171722-1002
zQuad Small Form Factor Pluggable Plus (zQSFP+) Stacked Integrated 2-by-1, Connector and Cage with EMI Spring Finger, 76 Circuit, Gold (Au) Over Nickel Plated, Up/Down Light Pipe
Part Aliases: Molex 1717221002
The zQuad Small Form Factor Pluggable Plus (zQSFP+) Stacked Integrated 2-by-1 Connector and Cage, a high-performance solution for your connectivity needs. This compact yet powerful assembly features 76 gold-plated contacts over nickel, ensuring reliable signal transmission. With EMI spring fingers and a black housing, it offers enhanced electromagnetic interference protection. Designed for through-hole mounting with a .8mm pitch, it guarantees secure and efficient installation. Operating in a wide temperature range from -40 to 85°C, this connector is suited for diverse environments. Its right-angle orientation, PCB locator, and retention features facilitate easy integration. RoHS compliant and UL certified, it meets stringent quality standards. Perfect for board-to-board, wire-to-board, and module-to-board applications, this connector assembly is a versatile choice for high-speed connectivity projects.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 171722-1002 |
| Color: | Black |
| Series: | 171722 - zQSFP Plus - zQSFP |
| Amperage: | .5 A |
| Connector Type: | zQSFP Plus |
| Number of Contacts: | 76 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole - Compliant Pin |
| Contact Material: | Copper Alloy |
| Pitch: | 8 mm |
| Voltage: | 30 V AC/DC |
| Shield Type: | EMI Fingers |
| Material: | Thermoplastic |
| Number of Ports: | 2 |
| Orientation: | Right Angle |
| Keying: | No |
| Component Type: | Receptacle |
| Tail Length: | 1.2 mm |
| Operating Temperature Range: | -40 - 85 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Ground to Panel / PCB: | Yes |
| Number of Contacts Loaded: | 76 |
| Mating Cycles: | 100 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | .762 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 1.57 mm |
| Connector System: | Board to Board, Module to Board, Wire to Board |
| Contact Termination Plating: | Matte Tin |
| Electrical Model: | Yes |
| Lock to Mating Part: | Yes |
| Surface Mount Compatible: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 1717221002 |
| SKU: | MOL171722-1002 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 03/30/2023 | 512624 - Packaging Method/Quantity Changing. This notification is to inform you about Molex will change packing method. Remove box in box. it is only package improvement, SPQ & MOQ are same ,no any change to product dimension, function and fit | Download |
| 03/05/2022 | 511503 - Change Supplier. due to resin supply constraint molex shall add new source of resin used at ZQSFQ and ZSFP product family series with new supplier wote. | Download |
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download |
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download |
| 05/31/2021 | 510074 - Supplier Change. An alternative sourcing had been identified for the product families listed to make up for the winter storm supply constraints. | Download |
| 11/09/2020 | 509372- Capacity change or tool replacement. Notice of capacity expansion for zQSFP by duplication current sub module ASSY line. date code format: LDD0X range from 314 onwards. | Download |
| 04/01/2019 | 506283 - Capacity Change or Tool Replacement. This letter is to inform you that another set of tooling is being added to meet the current and future demands of this product. There will be no changes in the fit, form or function from the additional tooling when compared to the current tooling. | Download |
| 03/26/2019 | 506202 - Capacity Change or Tool Replacement. This letter is to inform you that another set of tooling is being added to meet the current and future demands of this product. There will be no changes in the fit, form or function from the additional tooling when compared to the current tooling. | Download |
| 03/01/2019 | 506285 - Capacity Change or Tool Replacement. This letter is to inform you that another set of tooling is being added to meet the current and future demands of this product. There will be no changes in the fit, form or function from the additional tooling when compared to the current tooling. | Download |
| 08/10/2018 | 505634 - Change to Product. Tray material will change from existing PVC at 1mm thickness to ESD APET at 1mm thickness. Tray design change improvement to further restrict connector movement within tray. No impact to fit, form, or function. | Download |
| 04/29/2016 | 500741 - Capacity change or tool replacement. This letter is to inform you that another set of tooling is being added to meet the current and future demands of this product. There will be no changes in the fit, form or function from the additional tooling when compared to the current tooling. | Download |
| 01/01/2016 | GCM 10730795 - New, Modified, Or Replacement Tooling. Molex is buildling 2 new molds for better production capacity of the Lightpipe and housing component used in zQSFP+ connector. The gating point of the housing new mold will be different from the current mold as shown. Both new molds will be used in production at Molex Singapore Plant. This change will not affect Form, Fit, or Function of the product. The new molds will be internally qualified before using for mass production. Products made in or after Jan 16 will contain components from the new mold. | Download |
| 12/01/2015 | GCM 10724605 - Supplier Changes To Raw Material. This letter is to informed you that there is a change in manufacturing location from Malaysia to China for plastic resin used in the products listed in the attachment initiated by the plastic resin maker. There is no impact to the product form, fit and function as the raw plastic resin material composition remains unchanged. Brand name is changed as well from Vectra to LAPEROS. | Download |