44282-0001
Modular Jack, Right Angle, Low Profile, Shielded, Surface Mount, 8/8
Enhance connectivity with our Right Angle Low Profile Shielded Modular Jack, designed for seamless Surface Mount installation. This Female RJ45 connector, part of our RJ45 Modular Jack 8/8 series, guarantees reliable performance in high-speed data transmission. Crafted with precision using Brass and Phosphor Bronze contacts plated with Gold, it ensures optimal conductivity. Its durable High Temperature Thermoplastic body, meeting stringent material flammability standards, is suitable for a wide range of applications. The 90° Angle orientation, with PCB mounting capability and solder termination, offers flexibility in installation. Rest assured of its quality and compliance, with certifications from CSA and UL, RoHS compliance, and lead-free process capability, making it an environmentally friendly choice. Elevate your connectivity solutions with this premium component, ideal for demanding industrial and commercial environments.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 44282-0001 |
| Color: | Black |
| Series: | 44282 - Modular Jack 8/8 - RJ45 |
| Amperage: | 1.5 A |
| Connector Type: | Modular Jack 8/8, RJ45 |
| Gender: | Female |
| Termination Method: | Surface Mount |
| Contact Material: | Brass, Phosphor Bronze |
| Contact Plating: | Gold |
| Body Orientation: | Right Angle |
| Pitch: | 1.02 mm |
| Voltage: | 125 V |
| Material: | High Temperature Thermoplastic |
| Number of Ports: | 1 |
| Orientation: | 90° Angle |
| Component Type: | PCB Jack |
| Packaging: | Embossed Tape on Reel |
| Operating Temperature Range: | -40 - 80 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 1.27 µm |
| Ground to Panel / PCB: | Yes |
| Mating Cycles: | 500 |
| PCB Locator: | Yes |
| PCB Retention: | Without |
| Contact Termination Plating Thickness: | 2.540 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E107635 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 235 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 030 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Termination Pitch: | 1.27 mm |
| Non Magnetic: | Yes |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0442820001 |
| SKU: | MOL44282-0001 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 03/22/2018 | 505050 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label. No changes will be made to the product as a result of this change. | Download |
| 11/01/2017 | 501789 - Manufacturing Process Change Molex and Suppliers. This letter is to inform you that the manufacturing process for the part(s) identified in this notice is changing. No changes will be made to the product as a result of this process change. | Download |
| 11/01/2017 | 501881 - Change to Product. This letter is to inform you that changes are being made to the part(s) identified in this Notice. The change will affect the fit, form, function or appearance of the parts. Or, it may result in a change to the specification. | Download |
| 09/01/2016 | GCM 10731024 - Tooling / Equipment Transfer. The purpose of this letter is to inform you that Molex will make transfer the Modjack production line from Molex Lincoln NE to Molex Chengdu ,CN in 3 stages. This Change is to consolidate Modjacks and Magjack manufacturing in the same facility. The impact of the change will be our shield suppliers and housing suppliers will change to China based suppliers, and parts will now be manufactured and assembled in Chengdu. This product move will be implemented in 3 phases , over the course of approximately 7 months, starting April 2016. | Download |