46015-0802
Mini-Fit Plus Header, Dual Row, Vertical, 8 Circuits, without Snap-in Plastic Peg PCB Lock, without Drain Holes, PA Polyamide Nylon 6/6, UL 94V-0, Tin (Sn) 1.27µm Over Nickel (Ni) Plating
Part Aliases: Molex 0460150802
Enhance your PCB connections with our Mini-Fit Plus Header, featuring a dual-row design for optimal performance. Vertically oriented with 8 circuits, this header offers secure contact without the need for snap-in plastic pegs. Crafted from high-quality PA Polyamide Nylon 6/6 material, it ensures durability and reliability in various applications. With a current rating of 13 A and a voltage tolerance of 600 V, it meets stringent industry standards for safety and efficiency. The tin plating on copper alloy contacts guarantees excellent conductivity, while the straight body orientation and through-hole termination method simplify installation. Ideal for wire-to-board connections, this header is UL 94V-0 certified and RoHS compliant, making it a sustainable choice for your projects. Trust in the Mini-Fit Plus Header for seamless connectivity in your designs.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 46015-0802 |
| Color: | Natural |
| Series: | 46015 - Mini-Fit Plus |
| Amperage: | 13 A |
| Connector Type: | Mini-Fit Plus |
| Number of Contacts: | 8 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole |
| Contact Material: | Copper Alloy |
| Body Orientation: | Straight |
| Pitch: | 4.2 mm |
| Voltage: | 600 V |
| Material: | Nylon |
| Orientation: | Vertical |
| Keying: | No |
| Tail Length: | 1.8 mm |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Tin |
| Contact Mating Area Plating Thickness: | 2.54 µm |
| Number of Contacts Loaded: | 8 |
| Mating Cycles: | 75 |
| PCB Locator: | Yes |
| PCB Retention: | Without |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 1.27 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 1.78 mm |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | WAVE |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Glow Wire Capable: | No |
| Guide to Mating Part: | No |
| Lock to Mating Part: | Yes |
| Stackable: | No |
| Surface Mount Compatible: | No |
| Breakaway: | No |
| Make First / Break Last: | No |
| Shroud Type: | Fully |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0460150802 |
| SKU: | MOL46015-0802 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 07/18/2022 | 510809 - Change to product. current vertical header housings have a drain hole and non-drain hole version housing the drain holes are no longer needed (they were used in the past when PCB boards were being washed and are no longer needed) therefore we are eliminating the drain hole option going forward | Download |
| 02/14/2022 | 511607 - Retraction of PCN 510948. This PCN is a retraction/ recall of PCN 510809 communicated on 1/18/22 for "current vertical header housings have a drain hole and non-drain hole version housing the drain holes are no longer needed (they were used in the past when PCB boards were being washed and are no longer needed) therefore we are eliminating the drain hole option going forward." the reason for retraction is that part numbers that did not contain the drain hole option were included in the impacted parts list used to create pcn 510809 a new pcn will be created and customers will be notified | Download |
| 04/26/2021 | 509311 - Supplier Change. a second source material supplier is being added. to ensure ability to provide for current and future demand | Download |
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download |