54819-0572
Mini USB, B-Receptacle, Right-Angle, Surface Mount Solder Tails and Shell Tabs, with Cover Tape, Lead-Free
Part Aliases: Molex 0548190572
Elevate your connectivity with this high-performance Mini USB Receptacle. Designed for seamless integration, this USB OTG (On-The-Go) connector features a right-angle orientation and surface mount solder tails for easy installation. With a durable black shell and cover tape, it ensures reliable performance in any application. Boasting a 1A amperage and 30V voltage rating, it delivers efficient power transmission. The gold-plated contacts and shielded design guarantee optimal signal integrity, while the RoHS compliance reflects our commitment to environmental responsibility. Perfect for high-speed data transfer, this USB connector is a versatile solution for your connectivity needs.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 54819-0572 |
| Color: | Black |
| Series: | 54819 - USB 2.0 - USB OTG (On-The-Go) |
| Amperage: | 1 A |
| Connector Type: | USB, USB OTG (On-The-Go) |
| Gender: | Female |
| Number of Contacts: | 5 |
| Termination Method: | Surface Mount |
| Contact Material: | High Performance Alloy (HPA) |
| Maximum Operating Temperature: | 85 °C |
| Minimum Operating Temperature: | -20 °C |
| Body Orientation: | Right Angle |
| Pitch: | .8 mm |
| Voltage: | 30 V |
| Material: | Polyester Alloy |
| Orientation: | Right Angle |
| USB Type: | Mini-B |
| Component Type: | Receptacle |
| Packaging: | Embossed Tape on Reel |
| Operating Temperature Range: | -20 - 85 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 5 |
| Mating Cycles: | 5000 |
| PCB Locator: | No |
| Shielded: | Yes |
| PCB Retention: | Yes |
| Contact Termination Plating Thickness: | 1.016 µm |
| Polarized to Mate: | Yes |
| Supplier Product Group: | High Speed Cage & Connector Assemblies |
| Connector System: | Wire to Board |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 250 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 003 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Lock to Mating Part: | Yes |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0548190572 |
| SKU: | MOL54819-0572 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |