Molex Sentrality High-Current Pin and Socket Interconnect System

Molex's Sentrality Pin and Socket Interconnect System offers high-current board-to-board, busbar-to-board and busbar-to-busbar connectors and provides up to 1.0 mm of radial float in all four sizes to overcome tolerance stack-up issues. The interconnect system leverages the COEUR socket technology to assure ease of mating and also to prevent potential damage to the socket contact beams. The Sentrality high-current interconnect system offers a mated profile as low as approximately 2.00 mm in all four sizes, without comprising the requirement of large protrusions above or below the mated boards. Power efficiency is critical to cost management in large power-consuming operations, such as datacenters, 5G radios, and EV power trains. The Sentrality high-current interconnect system is designed with multiple contact beams per socket. This design serves to assure a solid electrical performance (low voltage drop).