5747841-2
15 MSFL PLUG RA 318 (FM,BL)
Enhance your electronic connections with our versatile D-Sub Connector, meticulously crafted for optimal performance. This high-quality component features UL 94V-0 rated durability, ensuring safety and reliability in any application. With a 15-contact, 2-row design, it offers seamless connectivity for a variety of devices. The brass contacts, plated with gold over palladium nickel, guarantee efficient signal transmission. Its board mount configuration and standard profile make installation a breeze. Compliant with RoHS regulations, this connector is not only environmentally friendly but also RoHS certified. Upgrade your setup with this essential piece of connectivity hardware.
| Product Category: | |
|---|---|
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | 5747841-2 |
| Amperage: | 6 A |
| Gender: | Plug |
| Number of Contacts: | 15 |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Contact Material: | Brass |
| Contact Plating: | Gold, Gold over Palladium Nickel |
| Pitch: | 2.74 mm |
| Number of Positions: | 15 |
| Profile: | Standard |
| Packaging: | Tray |
| Shell Type: | Front Metal Shell |
| Standards Met: | UL 94V-0 |
| SKU: | AMP5747841-2 |
| Insert Material: | Zinc |
| Shell Plating Material: | Tin |
| Post Size: | .026 in / .66 mm |
| Shell Material: | Carbon Steel |
| Plastic: | No |
| Eyelet Material: | Brass |
| Eyelet Plating Material: | Tin over Copper Flash |
| PCB Mount Orientation: | Right Angle |
| Preloaded: | Yes |
| Contact Base Material: | Brass |
| Contact Mating Area Plating Thickness: | 30 µin |
| Contact Shape and Form: | Round |
| PCB Contact Termination Area Plating Material: | Tin |
| PCB Thickness (Recommended): | .062 in / 1.57 mm |
| Housing Material: | Nylon / Polyester |
| Centerline (Pitch): | 2.74 mm / .108 in |
| Housing Color: | Black |
| UL Flammability Rating: | UL 94V-0 |
| Mating Connector Lock: | Without |
| PCB Mount Retention Type: | Boardlock |
| Mounting Hole Diameter: | 3.18 mm / .125 in |
| PCB Mounting Style: | Through Hole |
| PCB Mount Retention: | With |
| Connector Mounting Type: | Board Mount |
| Mating Retention: | Without |
| Boardlock Plating Material: | Tin over Nickel |
| Boardlock Material: | Copper Alloy |
| PCB Mount Alignment: | With |
| Montageausrichtung der Leiterplatte: | With |
| Panel Mount Feature: | Without |
| Circuit Application: | Signal |
| Connector System: | Board-to-Board |
| Footprint: | 8.08 mm / .318 in |
| Grounding Indents: | With |
| Grounding Straps: | With |
| Sealable: | No |
| Shell Size: | 2 |
| Grounded: | Yes |
| Row-to-Row Spacing: | .112 in / 2.84 mm |
| Product Type: | Connector |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Grounding Clips: | Without |
| Termination Post Length: | 3.18 mm / .125 in |
| Operating Temperature Range: | -67 - 221 °F / -55 - 105 °C |
| Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | P-22-023406 - Packaging Change. Improved packaging method and quality of package. © 2020 TE Connectivity. Confidential & Proprietary. Do not reproduce or distribute externally including non-authorized representatives and distributors. Create a sustainable future by limiting print copies, and recycling paper. Proposed package Improved packaging method does not require manual force to secure the tray with a new semi-automatic process. The main objective is to improve the quality of the package. |
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