826647-8
8P AMPMODU II STIFT LEI
Enhance your PCB connectivity with our AMPMODU Headers. Featuring a single row design with 8 positions, these headers are crafted from durable thermoplastic in a sleek green housing. With a pitch of 2.54mm and through hole solder termination method, they ensure secure and reliable connections. The gold contact mating area plating with a thickness of .8µm guarantees enhanced conductivity, while the tin plated contact termination offers optimal durability. Suitable for industrial use, these headers are UL 94V-0 compliant for safety. Their wave solder capability up to 265°C makes installation a breeze. Perfect for vertical mounting, they come in a pack of 500 for convenience. Upgrade your PCB assemblies with these high-quality connectors.
| Product Category: | |
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| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | 826647-8 |
| Series: | AMPMODU Headers |
| Housing Material: | Thermoplastic |
| Number of Rows: | 1 |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Pitch: | .1 in, 2.54 mm |
| Contact Type: | Pin |
| Strain Relief: | No Strain Relief |
| Row Spacing: | .1 in, 2.54 mm |
| Package Quantity: | 500 |
| Number of Positions: | 8 |
| Housing Color: | Green |
| Mount Orientation: | Vertical |
| GPL: | 015 |
| Profile: | Standard |
| Packaging: | Carton |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .8 µm |
| Panel Mount: | Without |
| PCB Retention: | Without |
| PCB Contact Termination Area Plating: | Tin |
| Mating Alignment: | Without |
| GPL Description: | Industrial |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 5233 |
| Post Size: | .024 in, .63 mm |
| Mating Post Length: | .228 in, 5.8 mm |
| ECCN: | EAR99 |
| Connector Contact Load Condition: | Fully Loaded |
| Contact Shape: | Square |
| Termination Post Tail Length: | .099 in, 2.5 mm |
| Header Type: | Breakaway |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | 3 µm |
| High Temperature Housing: | No |
| Temperature Rating: | Standard |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 826647-8 |
| SKU: | AMP826647-8 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 07/10/2014 | E-14-002835 - Product Improvement. Streamlining of contact base material. Plating process transfer to TE Bydgoszcz. To maintain a competitive position in the market place.Product tested and validated see test report 502-19945. | Download |
| 10/29/2012 | P-12-007877 - Manufacturing location change. | Download |