| Product Category: | |
| Manufacturer: | TE Connectivity | Deutsch |
| Manufacturer Part Number: | TE Connectivity | Deutsch 1062-20-0144 |
| SKU: | DCN1062-20-0144 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/30/2024 | PCN-24-219068 - Manufacturing location change. we hereby inform you of this manufacturing location change because our Rhode Island, USA supplier is closing and transferring the stamping/forming process to another TE approved supplier in USA. The manufacturing location change will not impact product or connector performance. | Download |
| 09/15/2018 | E-18-007949 - Manufacturing / Process Requirements. TE-ICT will update the gold region for the Size 20 stamped and formed Pins and Sockets. The thin gold flash layer will no longer extend into the crimp area, but the thick gold layer will remain in the Pin/Socket interface area. Tin will be added to the crimp area. This will not impact connector performance. IMPORTANT: This is a continual change so the current and previous revisions of this part can be used interchangeably in the field.This change is being phased in gradually and previous revisions may remain stocked until use. | Download |