151062-1704
2.00mm Pitch Milli-Grid Header, Surface Mount, Single Row, Vertical, 0.75
Enhance your PCB connectivity with our Milli-Grid connector, featuring a surface-mount termination method and a straight body orientation for seamless integration. This black connector, part of the 151062 series, boasts 4 contacts and a 2mm pitch, ensuring reliable power transmission at up to 125V AC and 2.5A. Crafted with copper alloy contacts and a liquid crystal polymer housing, it guarantees durability even in challenging environments. With gold over nickel plating in the contact mating area and tin over nickel in the termination, signal integrity is maintained over 25 mating cycles at temperatures ranging from -40 to 70°C. RoHS compliant and lead-free process capable, this connector meets high industry standards for quality and environmental responsibility. Perfect for wire-to-board applications, it offers secure PCB retention, polarization, and pick-and-place compatibility, making assembly a breeze. Whether for industrial machinery or consumer electronics, trust in the performance and longevity of this Milli-Grid connector.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | 151062-1704 |
| Color: | Black |
| Series: | 151062 - Milli-Grid |
| Amperage: | 2.5 A |
| Connector Type: | Milli-Grid |
| Number of Contacts: | 4 |
| Number of Rows: | 1 |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Body Orientation: | Straight |
| Pitch: | 2 mm |
| Voltage: | 125 V AC |
| Material: | Liquid Crystal Polymer |
| Orientation: | Vertical |
| Keying: | No |
| Packaging: | Tube |
| Pick and Place: | With Pick and Place Cap |
| Operating Temperature Range: | -40 - 70 °C |
| Contact Mating Area Plating: | Gold over Nickel |
| Contact Mating Area Plating Thickness: | .75 µm |
| Number of Contacts Loaded: | 4 |
| Mating Cycles: | 25 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2 µm |
| Polarized to Mate: | Yes |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Tin over Nickel |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Termination Pitch: | 2 mm |
| Glow Wire Capable: | No |
| Guide to Mating Part: | No |
| Lock to Mating Part: | Yes |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Breakaway: | No |
| Make First / Break Last: | No |
| Shroud Type: | Yes |
| Part Aliases: | 1510621704 |
| SKU: | MOL151062-1704 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 10/18/2024 | 514962 - Equipment Transfer, Production Transfer or Rearrangement. This notification is to inform about relocate production from Singapore to the Molex Malaysia production facility | Download |