26-60-4060
KK 396 Header, Vertical, Friction Lock, 6 Circuits, Tin (Sn) Plating
Part Aliases: Molex 0026604060 Molex 41791-0006
Easily connect wires to circuit boards with this KK 396 Header, featuring a vertical design and friction lock for secure attachment. With 6 circuits and tin plating, it ensures reliable conductivity. Made of durable polyester, it meets flammability standards for safety. The brass contacts and straight body orientation provide stability, while the 3.96mm pitch and 250V voltage rating cater to various applications. Ideal for wire-to-board connections, it is UL and CSA certified, RoHS compliant, and lead-free solder capable, guaranteeing quality and performance. Perfect for PCB assemblies in electronic devices.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 26-60-4060 |
| Color: | Natural |
| Series: | 41791 - KK 396 |
| Amperage: | 7 A |
| Connector Type: | KK 396 |
| Number of Contacts: | 6 |
| Number of Rows: | 1 |
| Termination Method: | Through Hole |
| Contact Material: | Brass |
| Body Orientation: | Straight |
| Pitch: | 3.96 mm |
| Voltage: | 250 V |
| Material: | Polyester |
| Orientation: | Vertical |
| Tail Length: | 3.56 mm |
| Packaging: | Bag |
| Contact Mating Area Plating: | Tin |
| Number of Contacts Loaded: | 6 |
| Mating Cycles: | 25 |
| PCB Locator: | No |
| PCB Retention: | Without |
| Polarized to PCB: | No |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 1.6 mm |
| Connector System: | Wire to Board |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Maximum Solder Process Temperature: | 235 °C |
| Lead Free Process Capability: | WAVE |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Glow Wire Capable: | No |
| Lock to Mating Part: | Yes |
| Stackable: | Yes |
| Breakaway: | No |
| Shroud Type: | Partial |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0026604060 41791-0006 |
| SKU: | MOL26-60-4060 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | 512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change | Download |
| 02/28/2022 | 511543 - Packaging Method/Quantity Changing. proposed packaging method is bulk packaging with air inflated bags there will be a change in DU & MLQ qty this packaging change is done to improve the packaging quality and to effectively protect the products during transit. new packaging concept was validated with drop test at 80cm drop height there are no product/process change for the listed parts. | Download |
| 11/12/2021 | 510732 - Capacity change or tool replacement. new capacity mold and assembly machine is getting added. wafers will be supplied from any of 1 existing mold or 1 new mold after the implementation date. headers will be supplied from any 4 existing machines or 1 new machine after the implementation date. | Download |
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download |
| 03/15/2019 | 506854 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label. | Download |
| 07/01/2017 | 502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download |