43860-0013
Modular Jack, Right Angle, Low Profile, Inverted, Shielded, Offset Panel Grounding Tabs, 8/8
Part Aliases: Molex 0438600013
Enhance your connectivity with our innovative Modular Jack, featuring a right angle, low profile design with shielded construction for optimal performance. Perfect for specialized setups, this jack boasts inverted orientation and offset panel grounding tabs, offering versatility in installation. With 8/8 RJ45 connectivity and a panel mount design, it ensures secure and reliable connections. Crafted from high-quality materials, including brass and phosphor bronze with gold plating, it guarantees durability and efficient signal transmission. Meeting stringent industry standards for safety and performance, this jack is ideal for various applications in networking and telecommunications. Elevate your setup with this essential component for seamless connectivity.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 43860-0013 |
| Color: | Black |
| Series: | 43860 - Modular Jack 8/8 - RJ45 |
| Amperage: | 1.5 A |
| Connector Type: | Modular Jack 8/8, RJ45 |
| Gender: | Female |
| Mount Type: | Panel Mount |
| Termination Method: | Through Hole |
| Contact Material: | Brass, Phosphor Bronze |
| Contact Plating: | Gold |
| Body Orientation: | Right Angle |
| Pitch: | 1.02 mm |
| Voltage: | 150 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Number of Ports: | 1 |
| Orientation: | 90° Angle |
| Component Type: | PCB Jack |
| Packaging: | Tray |
| Operating Temperature Range: | -40 - 85 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 1.27 µm |
| Ground to Panel / PCB: | Yes |
| Mating Cycles: | 500 |
| Panel Mount: | With |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| PCB Thickness (Recommended): | 1.57 mm |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E107635 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | WAVE |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Termination Pitch: | 1.02 mm |
| Surface Mount Compatible: | No |
| Non Magnetic: | Yes |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0438600013 |
| SKU: | MOL43860-0013 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 05/30/2022 | 511687 - Capacity change or tool replacement. This notification is to inform you about set of tooling is being added to meet the current and future demands of this product referenced below. There will be no changes in fit, form or function from additional tooling when compared to the existing tooling | Product Change Notice Download |
| 05/26/2019 | 505745 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change. | Product Change Notice Download |
| 11/01/2017 | 501789 - Manufacturing Process Change Molex and Suppliers. This letter is to inform you that the manufacturing process for the part(s) identified in this notice is changing. No changes will be made to the product as a result of this process change. | Product Change Notice Download |
| 09/01/2016 | GCM 10731024 - Tooling / Equipment Transfer. The purpose of this letter is to inform you that Molex will make transfer the Modjack production line from Molex Lincoln NE to Molex Chengdu ,CN in 3 stages. This Change is to consolidate Modjacks and Magjack manufacturing in the same facility. The impact of the change will be our shield suppliers and housing suppliers will change to China based suppliers, and parts will now be manufactured and assembled in Chengdu. This product move will be implemented in 3 phases , over the course of approximately 7 months, starting April 2016. | Product Change Notice Download |
| 01/04/2016 | GCM 10732378 - Product Component Change. This letter is to inform you that changes are being made to the part(s) identified in this Notice. The change will affect the fit, form, function or the appearance of the parts. | Product Change Notice Download |
| 06/19/2015 | GCM 10662459 - Product Component Change. Molex is sending this letter to announce a minor change to the modjack housing. A small portion of housing is being removed to allow the solder to flow evenly during the reflow soldering process. This change will not affect the circuit board layout or the function of the connector after it is soldered to the circuit board. | Product Change Notice Download |