44428-0804
Micro-Fit BMI Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 8 Circuits, Tin (Sn) Plating
Enhance your PCB connections with our Micro-Fit BMI Header. Designed for surface mount compatibility, this dual-row connector in a right-angle orientation features 8 circuits with tin plating for efficient signal transmission. With a contact material of brass and a high-temperature thermoplastic body, it ensures durability even in harsh environments. Offering a pitch of 3mm and a voltage rating of 600V, it meets rigorous performance standards. Perfect for board-to-board or wire-to-board applications, this connector is UL and CSA certified, guaranteeing safety and reliability. Its innovative design includes through-hole termination and PCB retention features, making installation a breeze. RoHS compliant and suitable for lead-free soldering processes, it's a sustainable and high-quality choice for your connectivity needs. Elevate your electronic projects with the Micro-Fit BMI Header.
Product Category: | |
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Manufacturer: | Molex |
Manufacturer Part Number: | 44428-0804 |
Color: | Black |
Series: | 44428 - Micro-Fit BMI |
Amperage: | 8.5 A |
Connector Type: | Micro-Fit BMI |
Number of Contacts: | 8 |
Number of Rows: | 2 |
Termination Method: | Through Hole |
Contact Material: | Brass |
Body Orientation: | Right Angle |
Pitch: | 3 mm |
Voltage: | 600 V |
Material: | High Temperature Thermoplastic |
Orientation: | Right Angle |
Keying: | No |
Tail Length: | 3.5 mm |
Packaging: | Tray |
Operating Temperature Range: | -40 - 105 °C |
Contact Mating Area Plating: | Tin |
Contact Mating Area Plating Thickness: | 5.08 µm |
Number of Contacts Loaded: | 8 |
Mating Cycles: | 30 |
PCB Locator: | Yes |
PCB Retention: | Without |
Polarized to PCB: | Yes |
Contact Termination Plating Thickness: | 5.08 µm |
PCB Thickness (Recommended): | 1.6 mm |
Connector System: | Board to Board, Wire to Board |
CSA Agency Certification: | LR19980 |
UL Agency Certification: | E29179 |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 260 °C |
Lead Free Process Capability: | WAVE |
Duration at Max. Process Temperature (seconds): | 005 |
Max. Cycles at Max. Process Temperature: | 001 |
Glow Wire Capable: | No |
Guide to Mating Part: | No |
Lock to Mating Part: | Yes |
Stackable: | No |
Surface Mount Compatible: | Yes |
Breakaway: | No |
Make First / Break Last: | No |
Shroud Type: | Fully |
Product Name: | Micro-Fit BMI |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 0444280804 |
SKU: | MOL44428-0804 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
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01/04/2016 | GCM 10733925 - Product Component Change. This letter is to inform you that changes are being made to the part(s) identified in this Notice. The change will affect the fit, form, function or the appearance of the parts. | Download |