44428-1401
Micro-Fit BMI Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 14 Circuits, Tin (Sn) Plating
Introducing the Micro-Fit BMI Header, a versatile and reliable connector for your PCB assembly needs. This dual-row, right-angle header features a snap-in plastic peg PCB lock for secure attachment. With 14 tin-plated circuits, it ensures efficient power transmission with a maximum amperage of 8.5 A. Constructed with high-temperature thermoplastic, it can withstand extreme operating temperatures ranging from -40 to 105 °C. Its through-hole termination method offers easy installation on PCBs up to 1.6 mm thick. UL and CSA certified, this connector guarantees safety and compliance with RoHS standards. Perfect for board-to-board and wire-to-board connections, it is a crucial component in various electronic applications. Whether you're designing consumer electronics or industrial machinery, the Micro-Fit BMI Header is the ideal solution for high-performance interconnectivity.
Product Category: | |
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Manufacturer: | Molex |
Manufacturer Part Number: | 44428-1401 |
Color: | Black |
Series: | 44428 - Micro-Fit BMI |
Amperage: | 8.5 A |
Connector Type: | Micro-Fit BMI |
Number of Contacts: | 14 |
Number of Rows: | 2 |
Termination Method: | Through Hole |
Contact Material: | Brass |
Body Orientation: | Right Angle |
Pitch: | 3 mm |
Voltage: | 600 V |
Material: | High Temperature Thermoplastic |
Orientation: | Right Angle |
Keying: | No |
Tail Length: | 3.5 mm |
Packaging: | Tray |
Operating Temperature Range: | -40 - 105 °C |
Contact Mating Area Plating: | Tin |
Contact Mating Area Plating Thickness: | 5.08 µm |
Number of Contacts Loaded: | 14 |
Mating Cycles: | 30 |
PCB Locator: | Yes |
PCB Retention: | Yes |
Polarized to PCB: | Yes |
Contact Termination Plating Thickness: | 5.08 µm |
PCB Thickness (Recommended): | 1.6 mm |
Connector System: | Board to Board, Wire to Board |
CSA Agency Certification: | LR19980 |
UL Agency Certification: | E29179 |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 260 °C |
Lead Free Process Capability: | WAVE |
Duration at Max. Process Temperature (seconds): | 005 |
Max. Cycles at Max. Process Temperature: | 001 |
Glow Wire Capable: | No |
Guide to Mating Part: | No |
Lock to Mating Part: | Yes |
Stackable: | No |
Surface Mount Compatible: | Yes |
Breakaway: | No |
Make First / Break Last: | No |
Shroud Type: | Fully |
Product Name: | Micro-Fit BMI |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 0444281401 |
SKU: | MOL44428-1401 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
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11/11/2022 | 512815 - Change Supplier. This notification is to inform you that one of Molex’s long standing North American supplier of Trays and Lids is filing for bankruptcy causing Molex to have to change our supplier source in order to continue to provide product to our customers. This will be a packaging supplier change only. There will be no change to the Production Process, Fit, Form or Function of the product packaged in these trays and lids. |
Download |
09/09/2022 | 512124 - Change Supplier. This notification is to inform you that a Supplier to Molex Lincoln Nebraska is adding an additional supplier source that will impact the part(s) attached as per list. No changes will be made to product as part of this change. Supplier source to Molex Lincoln Nebraska will be unchanged. | Download |
08/03/2022 | 512438 - Partial retraction of PCN 512124. reason for partial retraction is that material 80010815 & 80010818 should not have been part of PCN 512124 the other material numbers for 512124 are not affected by this partial retraction |
Download |
01/04/2016 | GCM 10733925 - Product Component Change. This letter is to inform you that changes are being made to the part(s) identified in this Notice. The change will affect the fit, form, function or the appearance of the parts. | Download |