74099-0006
SL Wire-to-Board Header, Surface Mount, Single Row, Vertical, 3.05mm Pocket, Shrouded, 6 Circuits, Tin (Sn) Plating
Easily connect wires to your PCB with our SL Wire-to-Board Header. This black, single-row connector features a vertical orientation with a 3.05mm shrouded pocket, ensuring secure and efficient placement. With 6 circuits and tin plating for reliable conductivity, it's ideal for a variety of applications. The high temperature thermoplastic construction, along with a wide operating temperature range of -40 to 105°C, guarantees durability in demanding environments. RoHS compliant and lead-free process capable, this connector is not only efficient but also environmentally friendly. Its surface mount compatibility and straight body orientation make installation a breeze. Trust in the SL Wire-to-Board Header for a high-quality, long-lasting connection solution.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 74099-0006 |
| Color: | Black |
| Series: | 74099 |
| Amperage: | 3 A |
| Connector Type: | SL |
| Number of Contacts: | 6 |
| Number of Rows: | 1 |
| Termination Method: | Surface Mount |
| Contact Material: | Brass, Phosphor Bronze |
| Body Orientation: | Straight |
| Pitch: | 2.54 mm |
| Voltage: | 250 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Tin |
| Contact Mating Area Plating Thickness: | 3.81 µm |
| Number of Contacts Loaded: | 6 |
| Mating Cycles: | 25 |
| Contact Termination Plating Thickness: | 3.81 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 1.6 mm |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 245 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 040 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Glow Wire Capable: | No |
| Surface Mount Compatible: | Yes |
| Breakaway: | No |
| Shroud Type: | Fully |
| Product Name: | SL |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0740990006 |
| SKU: | MOL74099-0006 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/30/2022 | 511846 - Capacity change or tool replacement Equipment Transfer, Production Transfer or Rearrangement. This notification is to inform about new die tooling fabricate in Malaysia is being added to meet the current and future demands of this product referenced below. This notification also add additional manufacturing location for Unity pin Series. The reason for the change is to secure the supply of Bandolier pin for Molex Malaysia. | Download |
| 08/31/2022 | 511584 - Change Supplier. This notification is to inform you about addition of 899922394 resin (Grade Name: SK Chemicals Skypura 7121F Black) as additional source for 70536 Series. The main reason to add 899922394 resin is to assure the supply of 70536 Series. No changes will be made to product as part of this change. | Download |
| 11/23/2020 | 509053 - Equipment Transfer, Production Transfer or Rearrangement. Molex will relocate production of the SL and C-Grid Product lines from the US & MX to the Molex Malaysia Production facility transfer will start in 2020 and target completion is 2021 buffer stock and capacity tooling will be built as needed to ensure a seamless transition. |
Download |
| 03/31/2020 | 507616 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different production location. No changes will be made to the product as a result of this move. | Download |