74099-2005
SL Wire-to-Board Header, Surface Mount, Single Row, Vertical, 3.05mm Pocket, Shrouded, 5 Circuits, 0.76
Introducing the SL Wire-to-Board Header, a sleek and efficient solution for your electronic connections. This single-row, vertical header features a 3.05mm pocket and shrouded design, ensuring secure and reliable connections. With 5 circuits and a 0.76 pitch, it offers versatility for various applications. Crafted from high-temperature thermoplastic and boasting a straight body orientation, this header is built to withstand tough conditions. Its surface mount termination method, along with gold contact mating area plating, guarantees optimal conductivity. RoHS compliant and lead-free process capable, it meets stringent environmental standards. Suitable for PCB thicknesses of 1.6mm, this header is a must-have for your PCB connector needs.
Product Category: | |
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Manufacturer: | Molex |
Manufacturer Part Number: | 74099-2005 |
Color: | Black |
Series: | 74099 |
Amperage: | 3 A |
Connector Type: | SL |
Number of Contacts: | 5 |
Number of Rows: | 1 |
Termination Method: | Surface Mount |
Contact Material: | Brass, Phosphor Bronze |
Body Orientation: | Straight |
Pitch: | 2.54 mm |
Voltage: | 250 V |
Material: | High Temperature Thermoplastic |
Orientation: | Vertical |
Operating Temperature Range: | -40 - 105 °C |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .762 µm |
Number of Contacts Loaded: | 5 |
Mating Cycles: | 50 |
Contact Termination Plating Thickness: | 1.905 µm |
Polarized to Mate: | Yes |
PCB Thickness (Recommended): | 1.6 mm |
Connector System: | Wire to Board |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 245 °C |
Lead Free Process Capability: | REFLOW |
Duration at Max. Process Temperature (seconds): | 040 |
Glow Wire Capable: | No |
Surface Mount Compatible: | Yes |
Breakaway: | No |
Shroud Type: | Fully |
Product Name: | SL |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 0740992005 |
SKU: | MOL74099-2005 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
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12/30/2022 | 511846 - Capacity change or tool replacement Equipment Transfer, Production Transfer or Rearrangement. This notification is to inform about new die tooling fabricate in Malaysia is being added to meet the current and future demands of this product referenced below. This notification also add additional manufacturing location for Unity pin Series. The reason for the change is to secure the supply of Bandolier pin for Molex Malaysia. | Download |
03/25/2015 | GCM 10659318 - Supplier Changes To Raw Material. | Download |