TE Reflow Capable Universal MATE-N-LOK Connectors
TE Connectivity's (TE) reflow capable universal MATE-N-LOK connectors were developed to allow printed circuit board (PCB) manufacturers to adopt reflow soldering assembly processes without sacrificing design flexibility. The thermoplastic housing is engineered to both withstand high reflow soldering temperatures and to mate with standard universal MATE-N-LOK connectors. This combination of features allows for easy transition from traditional PCB assembly to full reflow soldering processes.
- High temperature thermoplastic housing designed to support reflow soldering processes
- Compatible with standard universal MATE-N-LOK connectors
- Reduced mis-mating with polarized housing
- Ergonomic assembly with low insertion force (LIF) design
- Locking feature reduces risk of terminal back-out
- Pin and socket style contacts available
- Industrial (non-Robotics)
- Power Generation, Fuel & Energy
- Appliance & HVAC
- Computer / Datacom / Telecommunications
- Banking / Office / Retail Systems
- Appliances
- HVAC equipment
- Power supplies
- Security systems
- Elevator/ Escalator
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| 2 POS HIGH TEMP MATE-N-LOK PIN ASSM | |||
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| 3 POS HIGH TEMP MATE-N-LOK PIN ASSM | |||
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| 4 POS HIGH TEMP MATE-N-LOK PIN ASSM | |||
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| 5 POS HIGH TEMP MATE-N-LOK PIN ASSM | |||
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| 6 POS HIGH TEMP MATE-N-LOK PIN | |||
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| 2 POS HIGH TEMP MATE-N-LOK SKT | |||
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| Minimum: NA | Multiple: NA | ||
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| 3 POS HIGH TEMP MATE-N-LOK SKT ASSM | |||
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| 4 POS HIGH TEMP MATE-N-LOK SOCKET ASSM | |||
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| 5 POS HIGH TEMP MATE-N-LOK SKT ASSM | |||
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| Minimum: NA | Multiple: NA | ||
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| 6 POS HIGH TEMP MATE-N-LOK SKT | |||
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| 3 ROW 6P HIGH TEMP UMNL PIN ASSM | |||
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| 3 ROW 9P HIGH TEMP UMNL PIN ASSM | |||
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| 12 POS HIGH TEMP MATE-N-LOK PIN ASSM | |||
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| 3 ROW 15P HIGH TEMP UMNL PIN A | |||
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| 3 ROW 6P HIGH TEMP UMNL SKT ASSM | |||
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| 3 ROW 9P HIGH TEMP UMNL SKT AS | |||
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| Minimum: NA | Multiple: NA | ||
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| 3 ROW 12P HIGH TEMP UMNL SKT ASSM | |||
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| Minimum: NA | Multiple: NA | ||
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| 15P UMNL PCB Socket Header, Vert, 3X5, Black, Reflow Capable | |||