2201778-1
MICRO SD PUSH PUSH LOW PROFILE TYPE
Enhance your device connectivity with our state-of-the-art Micro SD Push Push Low Profile Type connector. Crafted with precision and meeting UL 94V-0 standards, this connector ensures safe and reliable performance. With a contact material of Copper Alloy and gold plating, it guarantees optimal conductivity. Designed for Micro Secure Digital cards, it features 8 contacts in a single row with a right-angle body orientation, perfect for board mount applications. With a pitch of 1.1mm (.04 in), it offers seamless integration. RoHS compliant and packaged in Tape & Reel, it's both environmentally friendly and easy to handle during assembly. Upgrade your electronic systems with this essential component for Memory Sockets & Connectors.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2201778-1 |
| Amperage: | .5 A |
| Connector Type: | Micro Secure Digital |
| Number of Contacts: | 8 |
| Number of Rows: | 1 |
| Mount Type: | Board Mount |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold |
| Body Orientation: | Right Angle |
| Pitch: | .04 in, 1.1 mm |
| Compatible Card Type: | Micro SD |
| Number of Positions: | 8 |
| Packaging: | Tape & Reel |
| Contact Mating Area Plating: | Gold |
| PCB Mounting Style: | Surface Mount |
| Standards Met: | UL 94V-0 |
| SKU: | AMP2201778-1 |
| Color: | Black |
| Shell Material: | Copper Alloy |
| Hold-Down: | Without |
| Operating Function: | Push-On Push-Off |
| Lead Configuration: | Inline |
| Vacuum Tape: | Without |
| PCB Contact Termination Area Plating Material: | Gold Flash |
| Contact Underplating Material: | Nickel |
| Contact Base Material: | Copper Alloy |
| Solder Tab Length: | .024 in / .6 mm |
| Height Above PC Board: | .065 in / 1.65 mm |
| Housing Color: | Black |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| UL Flammability Rating: | UL 94V-0 |
| Mounting Angle: | Right Angle |
| Circuit Application: | Signal |
| Shielded: | No |
| Product Type: | Removable Memory Products |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Operating Temperature Range: | -30 - 85 °C / -22 - 185 °F |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 04/11/2016 | P-16-012579 - UPDATE TO PCN P-16-012527. To ensure a smooth and stable transition from SWDC to EPDC, TE will be delaying the transition from the current Santa Teresa, NM DC (SWDC) to the new El Paso, TX DC (EPDC), originally scheduled to implement February 8th - 15th, is now scheduled to implement April 11th - 15th. This delay will allow extended testing on all SAP systems and procedures to ensure a seamless transition into the new warehouse. As we migrate the product and go-live on the new SAP WM software, it is critical to ensure this testing and training is fully incorporated into the systems and operational processes in the new El Paso warehouse. Based on the revised timing of transition, both Customer Shipments and Supplier Deliveries will continue to process from the Santa Teresa, NM location: Address: 101 Lindbergh, Santa Teresa, NM 88008, DUNS Code: 036967748. See attached Customer Letter. | Download |
| 02/15/2016 | P-16-012527 - Location Change. TE has established a new Distribution Center in El Paso, TX to support our South-West Customers. The transition to El Paso will take place during the weekend of February 13th - 14th. | Download |