Enhance cable connections with this Diecast Strain Relief Kit, designed for Shell Size 3 applications. Featuring a Two-Piece RFI/EMI Shield clamp with stainless steel latch, it ensures secure positioning for up to 25 positions. The shield plating, nickel over copper, offers reliable protection, while the 90° cable exit angle accommodates various setups. With an operating temperature range of -55 to 105°C (-67 to 221°F), this kit is suitable for diverse environments. ROHS compliant and with a slide latch for convenience, it's an essential accessory for robust cable management in data and device applications.
Availability
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL:800.400.7041
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5745653-3
Series:AMPLIMITE Kit
Accessory Type:Backshell/Cable Clamp
Shell Size:3
Latch Material:Stainless Steel
Clamp Type:Two-Piece RFI/EMI Shield
Number of Positions:25
Shield Plating Material:Nickel over Copper
Shield Plating Finish:Bright
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
Shielded:Yes
Screw Hole Thread Size:4-40
Cable Exit Angle:90°
Cable Insulation Diameter:10.92 mm, .43 in
Grommets:Without
Cable Clamp Material:Zinc Alloy
Slide Latch:With
Part Aliases:5745653-3
SKU:AMP5745653-3

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
10/01/2021P-21-020808 - Manufacturing Location Change. The Data and Devices business unit of TE Connectivity ( TE ) is moving its current manufacturing site in Hermosillo, MX to a new manufacturing site in the same city of Hermosillo, MX. The new site is only approximately 3.5 mi (equivalent to approximately 5 km) away from the current site. We plan to migrate all the existing manufacturing equipment relating to the products listed below from our current site to the new site.
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