5747844-2
09 MSFL RCPT RA 318 (FM,BL)
Introducing a high-performance D-Sub connector, designed for seamless board mounting in electronic applications. With UL 94V-0 certification, this connector guarantees superior safety and reliability. Featuring a receptacle gender and a durable thermoplastic housing, it ensures long-lasting performance. The connector offers 9 contacts in 2 rows, with phosphor bronze contact material and gold plating for optimal conductivity. With a 2.74mm pitch and standard profile, it provides easy integration into your designs. Mating retention is facilitated by inserts, while the front metal shell ensures secure connectivity. RoHS compliant and packaged in a convenient tray, this connector is the perfect choice for your connectivity needs.
Product Category: | |
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Manufacturer: | TE Connectivity |
Manufacturer Part Number: | 5747844-2 |
Amperage: | 6 A |
Gender: | Receptacle |
Housing Material: | Thermoplastic |
Number of Contacts: | 9 |
Number of Rows: | 2 |
Mount Type: | Board Mount |
Contact Material: | Phosphor Bronze |
Contact Plating: | Gold |
Pitch: | 2.74 mm |
Number of Positions: | 9 |
Profile: | Standard |
Mating Retention Type: | Inserts |
Packaging: | Tray |
Shell Type: | Front Metal Shell |
Standards Met: | UL 94V-0 |
SKU: | AMP5747844-2 |
Eyelet Plating Material: | Tin |
Eyelet Material: | Brass |
Post Size: | .026 in / .66 mm |
Shell Plating Material: | Tin |
Insert Material: | Zinc |
Plastic: | No |
Shell Material: | Steel |
PCB Mount Orientation: | Right Angle |
Preloaded: | Yes |
PCB Contact Termination Area Plating Material: | Tin |
Contact Mating Area Plating Thickness: | 30 µin |
Contact Shape and Form: | Round |
Contact Base Material: | Phosphor Bronze |
PCB Thickness (Recommended): | 1.58 mm / .062 in |
Centerline (Pitch): | .108 in / 2.74 mm |
Housing Material: | Thermoplastic |
Housing Color: | Black |
UL Flammability Rating: | UL 94V-0 |
PCB Mount Retention Type: | Boardlock |
Mounting Hole Diameter: | 3.18 mm / .125 in |
PCB Mounting Style: | Through Hole |
PCB Mount Retention: | With |
Mating Connector Lock: | Without |
Mating Retention: | With |
Boardlock Material: | Copper Alloy |
Mating Connector Lock Type: | Mounting Holes |
PCB Mount Alignment: | With |
Montageausrichtung der Leiterplatte: | With |
Panel Mount Feature: | Without |
Boardlock Plating Material: | Tin |
Connector Mounting Type: | Board Mount |
Circuit Application: | Signal |
Footprint: | 8.08 mm / .318 in |
Connector System: | Board-to-Board |
Grounded: | No |
Connector and Contact Terminates To: | Printed Circuit Board |
Shell Size: | 1 |
Grounding Indents: | Without |
Row-to-Row Spacing: | 2.84 mm / .112 in |
Product Type: | Connector |
Grounding Straps: | With |
Sealable: | No |
Termination Post Length: | .125 in / 3.18 mm |
Grounding Clips: | Without |
Operating Temperature Range: | -55 - 105 °C / -67 - 221 °F |
Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
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10/30/2017 | P-17-014029 - Manufacturing Location Change. TE Connectivity (TE) is moving manufacturing location of the products listed below from TE Hermosillo to TE Guangdong. Please contact your TE Sales Engineer with questions. | Download |