5747840-5
HD-20 PLUG RA .318 FMS BD-LK S
Elevate your connectivity with the HD-20 PLUG RA .318 FMS BD-LK S, a high-performance D-Sub connector designed for seamless board mounting. Featuring UL 94V-0 compliance, this plug ensures safety and reliability in your electronic systems. With 9 gold flash-plated brass contacts in a dual-row configuration, it guarantees efficient signal transmission. The 2.74 mm pitch and screw mating retention type offer easy and secure installation. Encased in a durable front metal shell, this connector is built to withstand demanding environments. RoHS compliant and packaged in a convenient tray, it's a must-have component for professional and DIY projects alike. Upgrade your IO connectivity with the HD-20 PLUG RA .318 FMS BD-LK S.
Product Category: | |
Manufacturer: | TE Connectivity |
Manufacturer Part Number: | TE Connectivity 5747840-5 |
Amperage: | 6 A |
Gender: | Plug |
Number of Contacts: | 9 |
Number of Rows: | 2 |
Mount Type: | Board Mount |
Contact Material: | Brass |
Contact Plating: | Gold Flash |
Pitch: | 2.74 mm |
Number of Positions: | 9 |
Profile: | Standard |
Mating Retention Type: | Screw |
Packaging: | Tray |
Shell Type: | Front Metal Shell |
Standards Met: | UL 94V-0 |
SKU: | AMP5747840-5 |
Post Size: | .026 in / .66 mm |
Shell Plating Material: | Tin |
Female Screwlock Material: | Zinc |
Female Screwlock Plating Material: | Clear Chromate |
Plastic: | No |
Eyelet Material: | Brass |
Eyelet Plating Material: | Tin over Copper Flash |
Shell Material: | Carbon Steel |
Insert Material: | Zinc |
Preloaded: | Yes |
PCB Mount Orientation: | Right Angle |
Contact Shape and Form: | Round |
PCB Contact Termination Area Plating Material: | Tin |
Contact Base Material: | Brass |
Contact Mating Area Plating Thickness: | 30 µin |
PCB Thickness (Recommended): | 1.57 mm / .062 in |
Centerline (Pitch): | 2.74 mm / .108 in |
Housing Material: | Polyester / Nylon |
Housing Color: | Black |
UL Flammability Rating: | UL 94V-0 |
Montageausrichtung der Leiterplatte: | With |
PCB Mount Alignment: | With |
Mating Retention: | With |
Boardlock Plating Material: | Tin over Nickel |
Panel Mount Feature: | Without |
Mating Connector Lock: | With |
Mounting Hole Diameter: | .125 in / 3.17 mm |
PCB Mount Retention: | With |
PCB Mounting Style: | Through Hole |
Connector Mounting Type: | Board Mount |
Mating Connector Lock Type: | Female Screwlocks, Fixed |
PCB Mount Retention Type: | Boardlock |
Boardlock Material: | Copper Alloy |
Circuit Application: | Signal |
Footprint: | .318 in / 8.08 mm |
Grounding Indents: | With |
Connector System: | Board-to-Board |
Sealable: | No |
Shell Size: | 1 |
Row-to-Row Spacing: | .112 in / 2.84 mm |
Connector and Contact Terminates To: | Printed Circuit Board |
Grounded: | Yes |
Grounding Straps: | With |
Product Type: | Connector |
Grounding Clips: | Without |
Termination Post Length: | .125 in / 3.17 mm |
Operating Temperature Range: | -67 - 221 °F / -55 - 105 °C |
Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
12/31/2022 | P-22-023406 - Packaging Change. Improved packaging method and quality of package. © 2020 TE Connectivity. Confidential & Proprietary. Do not reproduce or distribute externally including non-authorized representatives and distributors. Create a sustainable future by limiting print copies, and recycling paper. Proposed package Improved packaging method does not require manual force to secure the tray with a new semi-automatic process. The main objective is to improve the quality of the package. | Download |
04/01/2013 | Project Lantern PTP Migration Parts - MNF. location change from NC. | Download |