5747844-5
09 MSFL RCPT RA 318 (SL,FM,BL)
Enhance your connectivity with the AMPLIMITE HD-20 D-Sub Connector, a high-performance solution designed for demanding applications. Crafted with precision, this connector boasts a durable thermoplastic housing and UL 94V-0 certification for exceptional safety. Featuring a receptacle gender and board mount design, it offers seamless integration onto your circuit board. With 9 contacts arranged in 2 rows, each made of reliable phosphor bronze with gold flash plating, you can trust in its superior conductivity. The 2.74mm pitch and standard profile ensure compatibility with various systems, while the screw mating retention type guarantees a secure connection. RoHS compliant and packaged for convenience, this connector is a must-have for your connectivity needs. Elevate your setups with the AMPLIMITE HD-20 and experience reliable performance like never before.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5747844-5 |
| Series: | AMPLIMITE HD-20 |
| Amperage: | 6 A |
| Gender: | Receptacle |
| Housing Material: | Thermoplastic |
| Number of Contacts: | 9 |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold Flash |
| Pitch: | 2.74 mm |
| Number of Positions: | 9 |
| Profile: | Standard |
| Mating Retention Type: | Screw |
| Packaging: | Package |
| Shell Type: | Front Metal Shell |
| Standards Met: | UL 94V-0 |
| SKU: | AMP5747844-5 |
| Female Screwlock Plating Material: | Clear Chromate |
| Eyelet Material: | Brass |
| Insert Material: | Zinc |
| Shell Plating Material: | Tin |
| Plastic: | No |
| Post Size: | .66 mm / .026 in |
| Eyelet Plating Material: | Tin |
| Shell Material: | Steel |
| Female Screwlock Material: | Zinc |
| Preloaded: | Yes |
| PCB Mount Orientation: | Right Angle |
| PCB Contact Termination Area Plating Material: | Tin |
| Contact Base Material: | Phosphor Bronze |
| Contact Shape and Form: | Round |
| PCB Thickness (Recommended): | 1.58 mm / .062 in |
| Centerline (Pitch): | 2.74 mm / .108 in |
| Housing Color: | Black |
| Housing Material: | Thermoplastic |
| UL Flammability Rating: | UL 94V-0 |
| Panel Mount Feature: | Without |
| Mating Connector Lock: | With |
| Boardlock Plating Material: | Tin |
| Connector Mounting Type: | Board Mount |
| Mating Connector Lock Type: | Female Screwlocks, Fixed |
| Mounting Hole Diameter: | 3.18 mm / .125 in |
| PCB Mounting Style: | Through Hole |
| PCB Mount Retention: | With |
| PCB Mount Retention Type: | Boardlock |
| Mating Retention: | With |
| Boardlock Material: | Copper Alloy |
| PCB Mount Alignment: | With |
| Montageausrichtung der Leiterplatte: | With |
| Circuit Application: | Signal |
| Footprint: | .318 in / 8.08 mm |
| Connector System: | Board-to-Board |
| Sealable: | No |
| Grounding Indents: | Without |
| Shell Size: | 1 |
| Row-to-Row Spacing: | .112 in / 2.84 mm |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Grounded: | No |
| Grounding Straps: | With |
| Product Type: | Connector |
| Termination Post Length: | 3.18 mm / .125 in |
| Grounding Clips: | Without |
| Operating Temperature Range: | -55 - 105 °C / -67 - 221 °F |
| Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | P-22-023406 - Packaging Change. Improved packaging method and quality of package. © 2020 TE Connectivity. Confidential & Proprietary. Do not reproduce or distribute externally including non-authorized representatives and distributors. Create a sustainable future by limiting print copies, and recycling paper. Proposed package Improved packaging method does not require manual force to secure the tray with a new semi-automatic process. The main objective is to improve the quality of the package. | Download |
| 10/01/2021 | P-21-020809 - Manufacturing Location Change. The Data and Devices business unit of TE Connectivity ( TE ) is moving its current manufacturing site in Hermosillo, MX to a new manufacturing site in the same city of Hermosillo, MX. The new site is only approximately 3.5 mi (equivalent to approximately 5 km) away from the current site. We plan to migrate all the existing manufacturing equipment relating to the products listed below from our current site to the new site. | Download |
| 10/30/2017 | P-17-014029 - Manufacturing Location Change. TE Connectivity (TE) is moving manufacturing location of the products listed below from TE Hermosillo to TE Guangdong. Please contact your TE Sales Engineer with questions. | Download |
| 04/01/2013 | Project Lantern PTP Migration Parts - MNF. location change from NC. | Download |