15-91-2100
2.54mm Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 10 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
Part Aliases: Molex 0015912100 Molex 71308-0010N
Easily connect and secure your PCB components with our C-Grid connector, designed for high-performance applications. Featuring a straight body orientation and surface mount termination method, it provides reliable connectivity in a compact form. With a pitch of 2.54 mm, 10 contacts, and 2 rows, it offers versatile options for your PCB layout. Constructed with durable high-temperature thermoplastic and phosphor bronze contacts plated with tin, it ensures long-lasting performance even in harsh environments. RoHS compliant and suitable for lead-free soldering processes, it meets industry standards for sustainability and quality. Perfect for board-to-board and wire-to-board connections, this connector is stackable, breakaway, and features vertical orientation for easy installation. Trust in its 250 V voltage rating, 3 A amperage, and wide operating temperature range of -40 to 105 °C for seamless integration into your electronic systems. Upgrade your PCB design with this essential component.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 15-91-2100 |
| Color: | Black |
| Series: | 71308 - C-Grid |
| Amperage: | 3 A |
| Connector Type: | C-Grid |
| Number of Contacts: | 10 |
| Number of Rows: | 2 |
| Termination Method: | Surface Mount |
| Contact Material: | Phosphor Bronze |
| Body Orientation: | Straight |
| Pitch: | 2.54 mm |
| Voltage: | 250 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Tin |
| Contact Mating Area Plating Thickness: | 3.81 µm |
| Number of Contacts Loaded: | 10 |
| Mating Cycles: | 25 |
| PCB Locator: | No |
| PCB Retention: | Without |
| Polarized to PCB: | No |
| Contact Termination Plating Thickness: | 3.81 µm |
| Polarized to Mate: | No |
| Connector System: | Board to Board, Wire to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 245 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 030 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Glow Wire Capable: | No |
| Lock to Mating Part: | No |
| Stackable: | Yes |
| Breakaway: | Yes |
| Shroud Type: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0015912100 71308-0010N |
| SKU: | MOL15-91-2100 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 03/31/2020 | 507616 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different production location. No changes will be made to the product as a result of this move. | Product Change Notice Download |
| 05/08/2018 | 505319 - Retraction. This notification is to advise you of a modification to a previously issued PCN. PCN 502635 and 502658 incorrectly communicated that certain products would be transferring to Shanghai and India respectfully. This "retraction" PCN is to notify distribution and other customers that the parts listed are not being transferred. | Product Change Notice Download |