171224-2011

zSFP+ Stacked Ganged Assembly with Metal Spring Fingers, 2-by-2 with 4 Light Pipes, 80 Circuits

Part Aliases: Molex 1712242011  
Introducing a cutting-edge zSFP+ Stacked Ganged Assembly boasting advanced features for high-speed connectivity. Designed for optimal performance, this assembly features a durable thermoplastic construction in sleek black, with metal spring fingers ensuring secure connections. With two rows and four ports, it offers versatility for various applications. Gold-plated contacts and a high-performance alloy guarantee reliable signal transmission, while 80 circuits cater to complex networking needs. Meeting stringent quality standards, including RoHS compliance, this assembly is ideal for demanding environments. Explore the next level of connectivity with this innovative solution.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL:800.400.7041
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 171224-2011
Color:Black
Series:171224 - zSFP Plus - zSFP
Amperage:.5 A
Connector Type:zSFP Plus
Gender:Female
Number of Rows:2
Termination Method:Through Hole - Compliant Pin
Contact Material:High Performance Alloy (HPA)
Pitch:.8 mm
Voltage:30 V AC
Material:Thermoplastic
Number of Ports:4
Orientation:Right Angle
Component Type:Receptacle
Packaging:Tray
Operating Temperature Range:-40 - 85 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:80
Mating Cycles:100
PCB Locator:Yes
Shielded:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:.762 µm
Polarized to Mate:Yes
PCB Thickness (Recommended):2.36 mm
Connector System:Module to Board
UL Agency Certification:E29179
Contact Termination Plating:Matte Tin
Termination Pitch:.8 mm
Lock to Mating Part:Yes
Surface Mount Compatible:No
Material Flammability Standard:94V-0
Part Aliases:1712242011
SKU:MOL171224-2011

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
03/05/2022511503 - Change Supplier. due to resin supply constraint molex shall add new source of resin used at ZQSFQ and ZSFP product family series with new supplier wote.Download
08/01/2021510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. Download
06/01/2021510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately.
Download
05/31/2021510074 - Supplier Change. An alternative sourcing had been identified for the product families listed to make up for the winter storm supply constraints.Download
10/15/2020508891- Capacity change or tool replacement. Singapore plant is expanding and duplicating existing sub-module assembly molds / plating/ wafer marriage tooling.Download
10/31/2019507382 - Capacity change or tool replacement. This letter is to inform you that another set of tooling is being added to meet the current and future demands of this product. There will be no changes in the fit, form or function from the additional tooling when compared to the current tooling.Download
05/08/2019507161 - Supplier change. Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. Download