171224-2011
zSFP+ Stacked Ganged Assembly with Metal Spring Fingers, 2-by-2 with 4 Light Pipes, 80 Circuits
Part Aliases: Molex 1712242011
Introducing a cutting-edge zSFP+ Stacked Ganged Assembly boasting advanced features for high-speed connectivity. Designed for optimal performance, this assembly features a durable thermoplastic construction in sleek black, with metal spring fingers ensuring secure connections. With two rows and four ports, it offers versatility for various applications. Gold-plated contacts and a high-performance alloy guarantee reliable signal transmission, while 80 circuits cater to complex networking needs. Meeting stringent quality standards, including RoHS compliance, this assembly is ideal for demanding environments. Explore the next level of connectivity with this innovative solution.
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 171224-2011 |
Color: | Black |
Series: | 171224 - zSFP Plus - zSFP |
Amperage: | .5 A |
Connector Type: | zSFP Plus |
Gender: | Female |
Number of Rows: | 2 |
Termination Method: | Through Hole - Compliant Pin |
Contact Material: | High Performance Alloy (HPA) |
Pitch: | .8 mm |
Voltage: | 30 V AC |
Material: | Thermoplastic |
Number of Ports: | 4 |
Orientation: | Right Angle |
Component Type: | Receptacle |
Packaging: | Tray |
Operating Temperature Range: | -40 - 85 °C |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .762 µm |
Number of Contacts Loaded: | 80 |
Mating Cycles: | 100 |
PCB Locator: | Yes |
Shielded: | Yes |
PCB Retention: | Yes |
Polarized to PCB: | Yes |
Contact Termination Plating Thickness: | .762 µm |
Polarized to Mate: | Yes |
PCB Thickness (Recommended): | 2.36 mm |
Connector System: | Module to Board |
UL Agency Certification: | E29179 |
Contact Termination Plating: | Matte Tin |
Termination Pitch: | .8 mm |
Lock to Mating Part: | Yes |
Surface Mount Compatible: | No |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 1712242011 |
SKU: | MOL171224-2011 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
---|---|
Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
03/05/2022 | 511503 - Change Supplier. due to resin supply constraint molex shall add new source of resin used at ZQSFQ and ZSFP product family series with new supplier wote. | Product Change Notice Download |
08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Product Change Notice Download |
06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Product Change Notice Download |
05/31/2021 | 510074 - Supplier Change. An alternative sourcing had been identified for the product families listed to make up for the winter storm supply constraints. | Product Change Notice Download |
10/15/2020 | 508891- Capacity change or tool replacement. Singapore plant is expanding and duplicating existing sub-module assembly molds / plating/ wafer marriage tooling. | Product Change Notice Download |
10/31/2019 | 507382 - Capacity change or tool replacement. This letter is to inform you that another set of tooling is being added to meet the current and future demands of this product. There will be no changes in the fit, form or function from the additional tooling when compared to the current tooling. | Product Change Notice Download |
05/08/2019 | 507161 - Supplier change. Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. | Product Change Notice Download |