52271-3079
Easy-On Type FFC/FPC Connector, Right-Angle, Surface Mount, ZIF, Bottom Contact Style, 30 Circuits, High Barrier Packaging
Effortlessly connect with precision using this Easy-On Type FFC/FPC Connector. Designed for convenience, its right-angle, surface mount orientation ensures seamless integration. Featuring a ZIF mechanism with bottom contact style and 30 circuits, it offers reliable performance. Crafted with high barrier packaging and durable materials, it guarantees long-lasting use in a wide range of applications. With a low amperage of .5 A and a maximum operating temperature of 85°C, it's both efficient and reliable. The phosphor bronze contact material, along with tin-bismuth plating, ensures optimal conductivity. RoHS compliant and featuring a compact design, this connector is a versatile solution for your connectivity needs.
| Product Category: | |
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| Manufacturer: | Molex |
| Manufacturer Part Number: | 52271-3079 |
| Color: | Natural |
| Series: | 52271 |
| Amperage: | .5 A |
| Connector Type: | Easy-On |
| Housing Material: | Nylon |
| Number of Rows: | 1 |
| Contact Material: | Phosphor Bronze |
| Maximum Operating Temperature: | 85 °C |
| Minimum Operating Temperature: | -40 °C |
| Body Orientation: | Right Angle |
| Pitch: | 1 mm |
| Voltage: | 50 V AC/DC |
| Material: | Nylon |
| Orientation: | Right Angle |
| Wire Type: | FFC/FPC |
| Actuator Type: | Slider |
| Operating Temperature Range: | -40 - 85 °C |
| Contact Mating Area Plating: | Tin-Bismuth |
| Number of Contacts Loaded: | 30 |
| Mating Cycles: | 30 |
| PCB Locator: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating: | Tin-Bismuth |
| Termination Pitch: | 1 mm |
| Mated Height: | 3 mm |
| Stackable: | No |
| PCB Mount Alignment Type: | Surface Mount |
| Product Name: | Easy-On |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0522713079 |
| SKU: | MOL52271-3079 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 02/01/2023 | 512302 - Equipment Transfer, Production Transfer or Rearrangement. Production plant location change - Current : Molex Kagoshima - After : Molex Vietnam * Change reason : To better serve our customers and to leverage our global manufacturing footprint, Molex will relocate production of the 1.0FPC 3.0H ZIF RA lines from Japan to Molex Vietnam production facility. The transfer will started in Q4 2022 and target to complete in Q1 2023. Buffer stock and capacity tooling will be built as need to ensure a seamless transfer. | Download |
| 07/31/2016 | 501264 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download |