54819-0519
Mini USB, B-Receptacle, Right-Angle, Through Hole Solder Tails and Shell Tabs, Lead-Free
Part Aliases: Molex 0548190519
Enhance your connectivity with this Mini USB Receptacle, designed for efficient data transfer in compact devices. Featuring a right-angle orientation, through hole solder tails, and shell tabs, it offers secure and stable attachment. The lead-free construction prioritizes environmental sustainability while ensuring high performance with a maximum amperage of 1A and a voltage rating of 30V. With five gold-plated contacts, this USB OTG (On-The-Go) connector guarantees reliable signal transmission. Its thermoplastic body, shielded design, and polarized mating orientation further enhance durability and signal integrity, making it an essential component for high-speed data applications. RoHS compliant and suitable for reflow soldering, it meets stringent industry standards for quality and reliability. Elevate your connectivity solutions with this versatile USB connector.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 54819-0519 |
| Color: | Black |
| Series: | 54819 - USB 2.0 - USB OTG (On-The-Go) |
| Amperage: | 1 A |
| Connector Type: | USB, USB OTG (On-The-Go) |
| Gender: | Female |
| Number of Contacts: | 5 |
| Termination Method: | Through Hole |
| Contact Material: | High Performance Alloy (HPA) |
| Maximum Operating Temperature: | 85 °C |
| Minimum Operating Temperature: | -20 °C |
| Body Orientation: | Right Angle |
| Pitch: | .8 mm |
| Voltage: | 30 V |
| Material: | Thermoplastic |
| Orientation: | Right Angle |
| USB Type: | Mini-B |
| Component Type: | Receptacle |
| Tail Length: | 1.8 mm |
| Operating Temperature Range: | -20 - 85 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 5 |
| Shielded: | Yes |
| PCB Retention: | Yes |
| Contact Termination Plating Thickness: | 1.016 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 1 mm |
| Supplier Product Group: | High Speed Cage & Connector Assemblies |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 010 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Lock to Mating Part: | Yes |
| Surface Mount Compatible: | Yes |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0548190519 |
| SKU: | MOL54819-0519 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |