71436-1864
1.00mm Pitch Mezzanine IEEE 1386 Plug, Surface Mount, Dual Row, Vertical Stacking, 64 Circuits, 7.35mm Unmated Height, without PCB Locator Pegs, with Robotic Placement Metal Cap, Embossed Tape on Reel Packaging
Enhance your PCB connectivity with our high-performance 1.00mm Mezz (IEEE 1386) connector, ideal for demanding applications. With 64 contacts in a straight, surface mount configuration, this connector ensures secure and reliable connections. Crafted from high-temperature thermoplastic and featuring gold contact plating, it guarantees durability and optimal signal transfer. Operating within a wide temperature range of -55 to 85°C, it is suitable for various environments. RoHS compliant and UL certified, it meets stringent quality standards. Perfect for board-to-board connections, this connector offers versatility and efficiency in your electronic projects. Elevate your connectivity solutions with this premium PCB connector.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 71436-1864 |
| Color: | Natural |
| Series: | 71436 - 1.00mm Mezz (IEEE 1386) |
| Amperage: | 1 A |
| Connector Type: | 1.00mm Mezz (IEEE 1386) |
| Number of Contacts: | 64 |
| Number of Rows: | 2 |
| Termination Method: | Surface Mount |
| Contact Material: | Phosphor Bronze |
| Body Orientation: | Straight |
| Pitch: | 1 mm |
| Voltage: | 100 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Packaging: | Embossed Tape on Reel |
| Pick and Place: | With Pick and Place Cap |
| Operating Temperature Range: | -55 - 85 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 64 |
| PCB Locator: | No |
| PCB Retention: | Without |
| Contact Termination Plating Thickness: | 1.905 µm |
| Polarized to Mate: | No |
| PCB Thickness (Recommended): | 1 mm |
| Connector System: | Board to Board |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Glow Wire Capable: | No |
| Lock to Mating Part: | No |
| Mated Height: | 11 mm, 14 mm, 9 mm |
| Stackable: | No |
| Breakaway: | No |
| Shroud Type: | Fully |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0714361864 |
| SKU: | MOL71436-1864 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 03/08/2024 | 514164 - Equipment Transfer, Production Transfer or Rearrangement. In order to increase the Molex manufacturing footprint, Molex will transfer the existing assembly lines to a local qualified assembly vendor |
Download |