Molex Impel Backplane Interconnect System
Molex's Impel Backplane Interconnect System permits data center migration to faster data rates (40 Gbps) without completely redesigning network architecture or replacing existing hardware. The Impel System delivers superior density and electrical performance, low cross-talk, low insertion loss and minimal performance variations across all channels and frequencies to 20 GHz.
The system's 92 Ohm rated nominal impedance enables the minimization of impedance discontinuities and its IEEE 10GBASE-KR and optical Internetworking Forum (OIF) Stat Eye Compliant Channel performance demonstrates end-to-end channel performance compliance.
Custom cable assemblies are also available.
- Designed for a direct connection of PCBs in an orthogonal orientation that improves airflow and reduces board-space constraints compared to backplane and midplane connector systems. Simplifies component management for contract manufacturers and designers.
- Shorter line cards and switch-module signal paths versus typical routed backplane connections that allows for overall robust signal channels.
- Two compliant-pin attach options and 18 to 72 differential pairs per orthogonal node that provide customers ultimate flexibility to optimize their designs for superior mechanical and electrical performance.
- Molex patent-pending Impel™ connector technology with tightly coupled differential-pair structure that provides optimal signal integrity and mechanical isolation through the connector system.
- Compact, compliant-pin backplane and daughtercard connectors with data rates scalable from 25 to 40 Gbps that enables backward and forward compatibility with various high-end system architectures.
- Industrial (non-Robotics)
- Computer / Datacom / Telecommunications
- Banking / Office / Retail Systems
- Military / Aerospace / Aviation
- Government / Academic / R&D
- Other
Data Networking Equipment, Servers, Storage Systems, Hubs, Switches, Routers, Central Office, Cellular Infrastructure, Multi-Platform Service, DSL, Cable Data and Industrial Equipment
Molex Impel Backplane Interconnect System Video
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| Impel 92 Ohm, 3 Pair Vertical Backplane Header, 1.90mm Pitch, Unguided, Open Endwalls, 8 Columns, 48 Circuits, Pin Length 4.90mm, Plated Through Hole Dimension 0.36mm | |||
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| Impel 92 Ohm, 6 Pair Vertical Backplane Header, 1.90mm Pitch, Unguided, Open Endwalls, 8 Columns, 96 Circuits, Pin Length 4.90mm, Plated Through Hole Dimension 0.36mm | |||
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| Minimum: NA | Multiple: NA | ||
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| Impel 92 Ohm, 6 Pair Vertical Backplane Header, 1.90mm Pitch, Right-Guided, Open Endwalls, 16 Columns, 192 Circuits, Pin Length 5.50mm, Plated Through Hole Dimension 0.36mm | |||
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| Immediate Shipment: | |||
| Minimum: NA | Multiple: NA | ||
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| Impel 92 Ohm, 6 Pair Right-Angle Daughtercard, 1.90mm Pitch, Unguided, 8 Columns, 96 Circuits, Plated Through Hole Dimension 0.36mm | |||
Images for Reference only
| Availability | |||
|---|---|---|---|
| Immediate Shipment: | |||
| Minimum: NA | Multiple: NA | ||
| Stock Location: | Unit Of Measure: | ||
| Factory Lead: | Factory Stock: | ||
| Impel 92 Ohm, 6 Pair Right-Angle Daughtercard, 1.90mm Pitch, Right Guided, 16 Columns, 192 Circuits, Plated Through Hole Dimension 0.36mm | |||
Images for Reference only
| Availability | |||
|---|---|---|---|
| Immediate Shipment: | |||
| Minimum: NA | Multiple: NA | ||
| Stock Location: | Unit Of Measure: | ||
| Factory Lead: | Factory Stock: | ||
| Impel 92 Ohm, 3 Pair Right-Angle Daughtercard, 1.90mm Pitch, Unguided, 8 Columns, 48 Circuits, Plated Through Hole Dimension 0.36mm | |||
Images for Reference only
| Availability | |||
|---|---|---|---|
| Immediate Shipment: | |||
| Minimum: NA | Multiple: NA | ||
| Stock Location: | Unit Of Measure: | ||
| Factory Lead: | Factory Stock: | ||
| Impel 92 Ohm 5 Pair Vertical Backplane Header, 1.90mm Pitch, Unguided, Open Endwalls, 10 Columns, 100 Circuits, Pin Length 4.90mm, Plated Through Hole Dimension 0.36mm | |||