5745781-6
09 MSFL RCPT RA 318 (SL,FM)
Introducing the AMPLIMITE HD-20 D-Sub Connector, a high-performance solution for your connectivity needs. This receptacle features a durable thermoplastic housing, ensuring reliability in demanding environments. With UL 94V-0 certification, it meets stringent safety standards. The 9 gold-plated contacts on 2 rows provide efficient signal transmission, while the phosphor bronze construction guarantees long-lasting durability. Designed for board mount installation with a 2.74mm pitch, it offers easy integration into your system. The front metal shell adds robustness, and the screw mating retention type ensures a secure connection. Whether you're in the industrial, aerospace, or telecommunications sector, this connector is the perfect choice for your applications. Rest assured, it is RoHS compliant, aligning with environmental regulations. Upgrade your connectivity setup with the AMPLIMITE HD-20 D-Sub Connector.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5745781-6 |
| Series: | AMPLIMITE HD-20 |
| Amperage: | 6 A |
| Gender: | Receptacle |
| Housing Material: | Thermoplastic |
| Number of Contacts: | 9 |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Pitch: | 2.74 mm |
| Number of Positions: | 9 |
| Profile: | Standard |
| Mating Retention Type: | Screw |
| Packaging: | Tray |
| Shell Type: | Front Metal Shell |
| Standards Met: | UL 94V-0 |
| SKU: | AMP5745781-6 |
| Plastic: | No |
| Female Screwlock Material: | Zinc |
| Post Size: | .66 mm / .026 in |
| Insert Material: | Zinc |
| Shell Material: | Carbon Steel |
| Shell Plating Material: | Tin |
| Eyelet Plating Material: | Tin |
| Female Screwlock Plating Material: | Clear Chromate |
| Eyelet Material: | Brass |
| PCB Mount Orientation: | Right Angle |
| Preloaded: | Yes |
| Contact Mating Area Plating Thickness: | 30 µin |
| Contact Base Material: | Phosphor Bronze |
| PCB Contact Termination Area Plating Material: | Tin |
| Contact Shape and Form: | Round |
| PCB Thickness (Recommended): | .062 in / 1.58 mm |
| Housing Material: | Thermoplastic |
| Centerline (Pitch): | 2.74 mm / .108 in |
| UL Flammability Rating: | UL 94V-0 |
| Mating Connector Lock Type: | Female Screwlocks, Fixed |
| Mounting Hole Diameter: | 3.18 mm / .125 in |
| PCB Mounting Style: | Through Hole |
| PCB Mount Retention: | With |
| Connector Mounting Type: | Board Mount |
| Mating Retention: | With |
| PCB Mount Alignment: | With |
| Montageausrichtung der Leiterplatte: | With |
| PCB Mount Retention Type: | Mounting Hole |
| Panel Mount Feature: | Without |
| Mating Connector Lock: | With |
| Circuit Application: | Signal |
| Footprint: | 8.08 mm / .318 in |
| Connector System: | Board-to-Board |
| Shell Size: | 1 |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Row-to-Row Spacing: | 2.84 mm / .112 in |
| Grounding Indents: | Without |
| Product Type: | Connector |
| Grounding Straps: | With |
| Sealable: | No |
| Termination Post Length: | .125 in / 3.18 mm |
| Grounding Clips: | Without |
| Operating Temperature Range: | -67 - 221 °F / -55 - 105 °C |
| Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | P-22-023406 - Packaging Change. Improved packaging method and quality of package. © 2020 TE Connectivity. Confidential & Proprietary. Do not reproduce or distribute externally including non-authorized representatives and distributors. Create a sustainable future by limiting print copies, and recycling paper. Proposed package Improved packaging method does not require manual force to secure the tray with a new semi-automatic process. The main objective is to improve the quality of the package. | Download |
| 10/01/2021 | P-21-020808 - Manufacturing Location Change. The Data and Devices business unit of TE Connectivity ( TE ) is moving its current manufacturing site in Hermosillo, MX to a new manufacturing site in the same city of Hermosillo, MX. The new site is only approximately 3.5 mi (equivalent to approximately 5 km) away from the current site. We plan to migrate all the existing manufacturing equipment relating to the products listed below from our current site to the new site. | Download |
| 10/30/2017 | P-17-014029 - Manufacturing Location Change. TE Connectivity (TE) is moving manufacturing location of the products listed below from TE Hermosillo to TE Guangdong. Please contact your TE Sales Engineer with questions. | Download |
| 04/01/2013 | Project Lantern PTP Migration Parts - MNF. location change from NC. | Download |