08-56-0106
KK 396 Crimp Terminal 2478, 18-24 AWG, Bag, Brass, 0.51
Enhance the connectivity of your power circuit with the KK 396 Crimp Terminal 2478. Designed for optimal performance, this female terminal is compatible with 18-24 AWG wires, offering a secure crimp or compression termination method. Crafted from high-quality brass with a gold-plated finish, it ensures reliable conductivity. Packaged in a convenient bag, it is ideal for various applications, from industrial machinery to consumer electronics. Meet RoHS compliance standards, guaranteeing eco-friendly manufacturing. Upgrade your wire-to-board connections with this essential component.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 08-56-0106 |
| Series: | 2478 - KK 396 - KK 508 |
| Connector Type: | KK 396, KK 508 |
| Gender: | Female |
| Termination Method: | Crimp or Compression |
| Contact Material: | Brass |
| Contact Plating: | Gold |
| Circuit Application: | Power |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .381 µm |
| Contact Termination Plating Thickness: | .051 µm |
| Wire Size: | 18 AWG, 20 AWG, 22 AWG, 24 AWG |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Gold |
| Wire Insulation Diameter: | 2.79 mm |
| Part Aliases: | 0008560106;2478-1-(550)L |
| SKU: | MOL08-56-0106 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/23/2021 | 510765 - Change to Product. We observed different terminal retention force for Phosphor Bronze & brass terminal, so updated the PS with correct requirement. No impact to fit form or function. | Download |
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download |