170814-0030
NeoScale High-Speed Mezzanine Receptacle, 2.80mm Pitch, 4x18, 72 Triads (216 Circuits), 8.00mm Connector Height, 0.76µm Gold (Au) Plating
Introducing the NeoScale High-Speed Mezzanine Receptacle, a cutting-edge solution for high-performance connectivity. With a compact 2.80mm pitch and 216 circuits in a 4x18 configuration, this receptacle is designed for seamless signal transmission. Featuring 8.00mm connector height and 0.76µm Gold (Au) plating, it ensures reliable conductivity in demanding applications. The high-performance alloy (HPA) contact material, along with solder or weld termination, guarantees robust connections. With a voltage rating of 30V AC/DC and amperage of 1A, it meets stringent power requirements. Constructed with high-temperature thermoplastic, it offers durability in harsh environments. Vertical orientation, keying, and PCB retention make it easy to install and secure on the board. RoHS compliant and lead-free process capable, it aligns with environmental regulations. Ideal for PCB applications demanding high-speed data transmission, the NeoScale Mezzanine Receptacle sets a new standard for performance and reliability in connectivity.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 170814-0030 |
| Color: | Black |
| Series: | 170814 - NeoScale |
| Amperage: | 1 A |
| Connector Type: | NeoScale |
| Number of Contacts: | 216 |
| Number of Rows: | 4 |
| Termination Method: | Solder or Weld |
| Contact Material: | High Performance Alloy (HPA) |
| Pitch: | 2.8 mm |
| Voltage: | 30 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Keying: | Yes |
| Tail Length: | 1.3 mm |
| Packaging: | Tray |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Ground to Panel / PCB: | No |
| Number of Contacts Loaded: | 216 |
| Mating Cycles: | 100 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Polarized to Mate: | Yes |
| Connector System: | Board to Board |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 020 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Electrical Model: | No |
| Glow Wire Capable: | No |
| Guide to Mating Part: | Yes |
| Lock to Mating Part: | No |
| Part Aliases: | 1708140030 |
| SKU: | MOL170814-0030 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |