43650-0427
Micro-Fit 3.0 Vertical Header, 3.00mm Pitch, Single Row, 4 Circuits, with PCB Polarizing Peg, Tin, Glow-Wire Capable, Black
Part Aliases: Molex 0436500427
Elevate your PCB connections with our Micro-Fit 3.0 Vertical Header. Featuring a 3.00mm pitch and a single row design, this header offers seamless integration with 4 circuits. Crafted with a durable black high temperature thermoplastic body and brass contacts plated with tin, it ensures reliable performance in demanding environments. With a current rating of 8.5A and a voltage tolerance of 600V, it's perfect for power and signal applications. The inclusion of a PCB polarizing peg enhances stability, while its glow wire capability and RoHS compliance prioritize safety and environmental responsibility. Whether operating in extreme temperatures ranging from -40 to 105°C or undergoing lead-free soldering processes, this header guarantees longevity and efficiency. Suitable for wire-to-board connections, it's a versatile solution for various electronic projects. Trust in the quality and performance of our Micro-Fit 3.0 Vertical Header for seamless and secure PCB connections.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 43650-0427 |
| Color: | Black |
| Series: | 43650 |
| Amperage: | 8.5 A |
| Connector Type: | Micro-Fit 3.0 |
| Number of Contacts: | 4 |
| Number of Rows: | 1 |
| Termination Method: | Through Hole |
| Contact Material: | Brass |
| Body Orientation: | Straight |
| Pitch: | 3 mm |
| Voltage: | 600 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Tail Length: | 3.18 mm |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Tin |
| Contact Mating Area Plating Thickness: | 2.54 µm |
| Number of Contacts Loaded: | 4 |
| Mating Cycles: | 30 |
| PCB Locator: | Yes |
| PCB Retention: | Without |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| PCB Thickness (Recommended): | 1.6 mm |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | SMC and Wave |
| Duration at Max. Process Temperature (seconds): | 030 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Glow Wire Capable: | Yes |
| Lock to Mating Part: | Yes |
| Mated Height: | 17.27 mm |
| Stackable: | No |
| Surface Mount Compatible: | Yes |
| Breakaway: | No |
| Shroud Type: | Fully |
| Product Name: | Micro-Fit 3.0 |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0436500427 |
| SKU: | MOL43650-0427 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 11/22/2024 | 515106 - Equipment transfer, production transfer rearrangement. Move the tooling molds from Lincoln to Nogales. | Download |
| 06/07/2024 | 514961 - Packaging Method/Quantity Changing. We are implementing a packaging material change to enhance stability and temperature resistance. As a result, sample availability for packaging is not applicable. | Download |
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download |
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download |
| 02/26/2021 | 509207 - Supplier Change. Change tray supplier from USA to Mexico to improve Delivery & Quality | Download |
| 12/31/2020 | 508352 - Supplier Change. actual molex tray supplier will close operations, molex is working getting new try supplier. | Download |
| 07/01/2017 | 502635 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download |
| 05/06/2015 | GCM 10664055 - Manufacturing Process Change. | Download |