50394-8052
Milli-Grid Crimp Terminal, Female, 0.76
Part Aliases: Molex 0503948052
Enhance your connectivity with our Milli-Grid Crimp Terminal, designed for seamless integration in various applications. Crafted for efficiency, this female terminal offers reliable performance with its copper alloy construction and nickel plating. With a voltage rating of 125V and amperage options ranging from 0.5A to 2A, it ensures optimal power transmission. The gold-plated mating area guarantees low contact resistance, while the crimp or compression termination method allows for easy installation. Perfect for wire-to-wire or wire-to-board connections, this terminal accommodates 24-30 AWG wire sizes, making it versatile for diverse projects. Rest assured of its quality and compliance with RoHS standards, as it undergoes thorough testing. Elevate your connectivity solutions with this essential component.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 50394-8052 |
| Series: | 50394 - Milli-Grid |
| Amperage: | 1.5 A, 1 A, 2 A, .5 A |
| Connector Type: | Milli-Grid |
| Gender: | Female |
| Termination Method: | Crimp or Compression |
| Contact Material: | Copper Alloy |
| Contact Plating: | Nickel |
| Voltage: | 125 V |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Contact Termination Plating Thickness: | 2.032 µm |
| Wire Size: | 24 AWG, 26 AWG, 28 AWG, 30 AWG |
| Connector System: | Wire to Board, Wire to Wire |
| Contact Termination Plating: | Nickel |
| Wire Insulation Diameter: | 1.4 mm |
| Part Aliases: | 0503948052 |
| SKU: | MOL50394-8052 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 10/20/2020 | 508388 - Manufacturing Process Change. change process from Stamping (Blanking = Forming) -> plating to stamping (blanking)-> plating-> stamping (forming) for gold spotting process capability. the plating process change from dipping + brushing -> selective dipping + spotting. | Download |