75783-0132
iPass I/O Surface Mount Receptacle, Right-Angle, Internal Assembly with Shell, 36 Circuit, 0.38?m Gold (Au), Through Hole Option, Tail Length 1.96mm, Universal Key
Introducing the iPass I/O Surface Mount Receptacle, designed for high-speed connectivity in demanding environments. This right-angle female connector features a 36-circuit configuration with a universal key, offering secure and reliable mating. With a contact plating of 0.38µm Gold (Au) and a termination pitch of .8mm, it ensures optimal signal transmission. The internal assembly with shell construction, along with a tail length of 1.96mm, provides versatility for through-hole mounting. Meeting RoHS compliance and operating within a wide temperature range of -40 to 80°C, this connector is suitable for various applications. From PCBs to wire-to-board connections, its high-performance alloy contacts and durable thermoplastic body guarantee long-term functionality. Perfect for PCI Express and Mini Multi-Lane setups, this component is essential for efficient data transfer in industrial and commercial systems.
Product Category: | |
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Manufacturer: | Molex |
Manufacturer Part Number: | 75783-0132 |
Color: | Black |
Series: | 75783 - iPass - Mini Multi-Lane - PCI Express |
Amperage: | .5 A |
Connector Type: | iPass, Mini Multi-Lane, PCI Express |
Gender: | Female |
Number of Contacts: | 36 |
Number of Rows: | 2 |
Termination Method: | Surface Mount and Through Hole |
Contact Material: | Copper-Nickel-Zinc, High Performance Alloy (HPA) |
Contact Plating: | Gold |
Body Orientation: | Right Angle |
Pitch: | .8 mm |
Voltage: | 30 V AC/DC |
Material: | Thermoplastic |
Number of Ports: | 1 |
Orientation: | Right Angle |
Keying: | Yes |
Component Type: | Receptacle |
Tail Length: | 1.96 mm |
Packaging: | Embossed Tape on Reel |
Operating Temperature Range: | -40 - 80 °C |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .381 µm |
Ground to Panel / PCB: | No |
Number of Contacts Loaded: | 36 |
Mating Cycles: | 50 |
PCB Locator: | Yes |
PCB Retention: | Yes |
Contact Termination Plating Thickness: | 2.540 µm |
Polarized to Mate: | Yes |
PCB Thickness (Recommended): | 1.57 mm |
Supplier Product Group: | High Speed Cage & Connector Assemblies |
Connector System: | Wire to Board |
CSA Agency Certification: | LR19980 |
UL Agency Certification: | E29179 |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 260 °C |
Lead Free Process Capability: | REFLOW |
Duration at Max. Process Temperature (seconds): | 020 |
Max. Cycles at Max. Process Temperature: | 001 |
Termination Pitch: | .8 mm |
Electrical Model: | Yes |
Lock to Mating Part: | No |
Surface Mount Compatible: | Yes |
Waterproof Dustproof: | No |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 0757830132 |
SKU: | MOL75783-0132 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
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07/14/2022 | 512019 - Change Supplier. This notification is to inform you about changes that are being made to the part(s) as identified in the list. This change is only the raw material supplier and will not affect fit, form or function. | Download |
08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download |
07/24/2021 | 509389 - Equipment Transfer, Production Transfer or Rearrangement. Molex will add mfg source to run the parts of IPASS at local qualified assembly vendors, regardless of the location, production conditions will remain the same meaning the same component from the same source the same process monitoring system and the same quality control plan. | Download |
07/11/2021 | 510341 - Supplier Change. Due to Supply constraints, molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders, therefore an alternative sourcing has been identified for product families listed. current supplier: Polyplastics resin Trade/grade: LAPERIS E130I BK205P Alternative Supplier: Celanese resin trade/grade: VECTRA E130I BK211P |
Download |
06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. |
Download |
06/18/2016 | GCM 10731102 - Manufacturing Process Change. The purpose of this letter is to inform you that Molex Chengdu will change the date code marking method from current ink printing to laser marking with auto machine for iPass series products. All validation is in process and we are expecting to complete the changeover action in the end of Apr 2016. This will improve our product's quality performance and tractability. We thank you for choosing Molex products. | Download |
01/01/2016 | GCM 10692749 - Supplier Change. The purpose if this letter is to inform you that Molex CD resin supplier will change production site from Malaysia &Taiwan to Nantong, China due to supplier strategic consolidate. | Download |
12/15/2015 | GCM 10715564 - Supplier Changes To Raw Material. This notification is to advise you of a change in supplier for the Nickel Silver base material used to make some components in some of Molex's products. The biggest users are cage components. Only the supplier will be changing, the type of the material will stay the same so there will be no impact to the form, fit, or function of the part. This change is needed because the current supplier is no longer offering the base material being used today. This will be a running change and will not affect the connector portion of the finished part. | Download |