75783-0051
iPass I/O Surface Mount Receptacle, Right-Angle, Internal Assembly with Shell, 26 Circuit, 0.76µm Gold (Au), Through Hole Option, Tail Length 3.18mm, Dual Key
Enhance your connectivity with the iPass I/O Surface Mount Receptacle, designed for seamless integration in your electronic setups. This high-performance component features a right-angle orientation with a dual-key design for secure mating. With 26 gold-plated contacts and a 0.8mm pitch, it ensures reliable data transmission in high-speed applications. The through-hole option and tail length of 3.18mm offer versatile installation possibilities. Constructed with durable materials and meeting stringent quality standards, this receptacle guarantees optimal performance and longevity. Perfect for PCI Express and other Mini Multi-Lane setups, it's an essential component for your connectivity needs.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 75783-0051 |
| Color: | Black |
| Series: | 75783 - iPass - Mini Multi-Lane - PCI Express |
| Amperage: | .5 A |
| Gender: | Female |
| Number of Contacts: | 26 |
| Number of Rows: | 2 |
| Termination Method: | Surface Mount and Through Hole |
| Contact Material: | Copper-Nickel-Zinc, High Performance Alloy (HPA) |
| Pitch: | .8 mm |
| Voltage: | 30 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Number of Ports: | 1 |
| Orientation: | Right Angle |
| Keying: | Yes |
| Component Type: | Receptacle |
| Tail Length: | 3.18 mm |
| Packaging: | Embossed Tape on Reel |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Ground to Panel / PCB: | No |
| Number of Contacts Loaded: | 26 |
| Mating Cycles: | 250 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 2.79 mm |
| Connector System: | Wire to Board |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 020 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Termination Pitch: | .8 mm |
| Electrical Model: | Yes |
| Lock to Mating Part: | No |
| Surface Mount Compatible: | Yes |
| Waterproof Dustproof: | No |
| Product Name: | iPass, Mini Multi-Lane, PCI Express |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0757830051 |
| SKU: | MOL75783-0051 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |