75783-0156

iPass I/O Surface Mount Receptacle, Right-Angle, Internal Assembly with Shell, 36 Circuit, 0.38?m Gold (Au), Through Hole Option, Tail Length 3.56mm, Universal Key

Introducing the iPass I/O Surface Mount Receptacle, designed for seamless connectivity in high-speed applications. This right-angle connector features a 36-circuit configuration with a 0.38µm Gold (Au) plating, ensuring reliable signal transmission. With a tail length of 3.56mm and through-hole option, it offers versatility in installation. The universal keying and polarized mating ensure proper alignment, while the rugged thermoplastic body and high-performance alloy contacts guarantee durability in harsh environments. Certified to meet industry standards, including RoHS compliance, it is ideal for use in PCI Express, Mini Multi-Lane, and other demanding applications. Whether for data centers, telecommunications, or industrial equipment, this connector provides a secure and efficient solution for your connectivity needs.
Availability
Immediate Shipment: NA
Stock Location: In Stock
Factory Stock: Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple: NA/NA
Pricing
CALL: 800.400.7041
Product Category:
Manufacturer: Molex
Manufacturer Part Number: 75783-0156
Color: Black
Series: 75783 - iPass - Mini Multi-Lane - PCI Express
Amperage: .5 A
Connector Type: iPass, Mini Multi-Lane, PCI Express
Gender: Female
Number of Contacts: 36
Number of Rows: 2
Termination Method: Surface Mount and Through Hole
Contact Material: Copper-Nickel-Zinc, High Performance Alloy (HPA)
Contact Plating: Gold
Body Orientation: Right Angle
Pitch: .8 mm
Voltage: 30 V AC/DC
Material: Thermoplastic
Number of Ports: 1
Orientation: Right Angle
Keying: Yes
Component Type: Receptacle
Tail Length: 3.56 mm
Packaging: Embossed Tape on Reel
Operating Temperature Range: -40 - 80 °C
Contact Mating Area Plating: Gold
Contact Mating Area Plating Thickness: .381 µm
Ground to Panel / PCB: No
Number of Contacts Loaded: 36
Mating Cycles: 50
PCB Locator: Yes
PCB Retention: Yes
Contact Termination Plating Thickness: 2.540 µm
Polarized to Mate: Yes
PCB Thickness (Recommended): 3.18 mm
Supplier Product Group: High Speed Cage & Connector Assemblies
Connector System: Wire to Board
CSA Agency Certification: LR19980
UL Agency Certification: E29179
Contact Termination Plating: Tin
Maximum Solder Process Temperature: 260 °C
Lead Free Process Capability: REFLOW
Duration at Max. Process Temperature (seconds): 020
Max. Cycles at Max. Process Temperature: 001
Termination Pitch: .8 mm
Electrical Model: Yes
Lock to Mating Part: No
Surface Mount Compatible: Yes
Waterproof Dustproof: No
Material Flammability Standard: 94V-0
Part Aliases: 0757830156
SKU: MOL75783-0156

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes:

Product Change Notice

Effective Date Description of Change Download
07/14/2022 512019 - Change Supplier. This notification is to inform you about changes that are being made to the part(s) as identified in the list. This change is only the raw material supplier and will not affect fit, form or function. Download
07/24/2021 509389 - Equipment Transfer, Production Transfer or Rearrangement. Molex will add mfg source to run the parts of IPASS at local qualified assembly vendors, regardless of the location, production conditions will remain the same meaning the same component from the same source the same process monitoring system and the same quality control plan. Download
10/23/2017 502465 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change. Download
06/18/2016 GCM 10731102 - Manufacturing Process Change. The purpose of this letter is to inform you that Molex Chengdu will change the date code marking method from current ink printing to laser marking with auto machine for iPass series products. All validation is in process and we are expecting to complete the changeover action in the end of Apr 2016. This will improve our product's quality performance and tractability. We thank you for choosing Molex products. Download
01/01/2016 GCM 10692749 - Supplier Change. The purpose if this letter is to inform you that Molex CD resin supplier will change production site from Malaysia &Taiwan to Nantong, China due to supplier strategic consolidate. Download
12/15/2015 GCM 10715564 - Supplier Changes To Raw Material. This notification is to advise you of a change in supplier for the Nickel Silver base material used to make some components in some of Molex's products. The biggest users are cage components. Only the supplier will be changing, the type of the material will stay the same so there will be no impact to the form, fit, or function of the part. This change is needed because the current supplier is no longer offering the base material being used today. This will be a running change and will not affect the connector portion of the finished part. Download