75783-0140

iPass I/O Surface Mount Receptacle, Right-Angle, Internal Assembly with Shell, 36 Circuit, 0.38?m Gold (Au), Through Hole Option, Tail Length 2.79mm, Universal Key

Introducing the iPass I/O Surface Mount Receptacle, designed for high-speed connectivity in PCI Express and Mini Multi-Lane systems. This right-angle female connector features a 36-circuit configuration with gold-plated contacts for optimal signal transmission. With a versatile through-hole option and tail length of 2.79mm, it offers secure PCB mounting. The universal keying ensures proper alignment, while the thermoplastic housing guarantees durability in harsh environments. Certified for RoHS compliance, this connector meets stringent quality standards for reliable performance. Perfect for wire-to-board applications, it's an essential component for high-speed data transfer in various electronic devices.
Availability
Immediate Shipment: NA
Stock Location: In Stock
Factory Stock: Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple: NA/NA
Pricing
CALL: 800.400.7041
Product Category:
Manufacturer: Molex
Manufacturer Part Number: 75783-0140
Color: Black
Series: 75783 - iPass - Mini Multi-Lane - PCI Express
Amperage: .5 A
Connector Type: iPass, Mini Multi-Lane, PCI Express
Gender: Female
Number of Contacts: 36
Number of Rows: 2
Termination Method: Surface Mount and Through Hole
Contact Material: Copper-Nickel-Zinc, High Performance Alloy (HPA)
Contact Plating: Gold
Body Orientation: Right Angle
Pitch: .8 mm
Voltage: 30 V AC/DC
Material: Thermoplastic
Number of Ports: 1
Orientation: Right Angle
Keying: Yes
Component Type: Receptacle
Tail Length: 2.79 mm
Packaging: Embossed Tape on Reel
Operating Temperature Range: -40 - 80 °C
Contact Mating Area Plating: Gold
Contact Mating Area Plating Thickness: .381 µm
Ground to Panel / PCB: No
Number of Contacts Loaded: 36
Mating Cycles: 50
PCB Locator: Yes
PCB Retention: Yes
Contact Termination Plating Thickness: 2.540 µm
Polarized to Mate: Yes
PCB Thickness (Recommended): 2.36 mm
Supplier Product Group: High Speed Cage & Connector Assemblies
Connector System: Wire to Board
CSA Agency Certification: LR19980
UL Agency Certification: E29179
Contact Termination Plating: Tin
Maximum Solder Process Temperature: 260 °C
Lead Free Process Capability: REFLOW
Duration at Max. Process Temperature (seconds): 020
Max. Cycles at Max. Process Temperature: 001
Termination Pitch: .8 mm
Electrical Model: Yes
Lock to Mating Part: No
Surface Mount Compatible: Yes
Waterproof Dustproof: No
Material Flammability Standard: 94V-0
Part Aliases: 0757830140
SKU: MOL75783-0140

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes:

Product Change Notice

Effective Date Description of Change Download
07/14/2022 512019 - Change Supplier. This notification is to inform you about changes that are being made to the part(s) as identified in the list. This change is only the raw material supplier and will not affect fit, form or function. Download
08/01/2021 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. Download
07/24/2021 509389 - Equipment Transfer, Production Transfer or Rearrangement. Molex will add mfg source to run the parts of IPASS at local qualified assembly vendors, regardless of the location, production conditions will remain the same meaning the same component from the same source the same process monitoring system and the same quality control plan. Download
07/11/2021 510341 - Supplier Change. Due to Supply constraints, molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders, therefore an alternative sourcing has been identified for product families listed.

current supplier: Polyplastics
resin Trade/grade: LAPERIS E130I BK205P

Alternative Supplier: Celanese
resin trade/grade: VECTRA E130I BK211P
Download
06/01/2021 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately.
Download
10/23/2017 502465 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change. Download
06/18/2016 GCM 10731102 - Manufacturing Process Change. The purpose of this letter is to inform you that Molex Chengdu will change the date code marking method from current ink printing to laser marking with auto machine for iPass series products. All validation is in process and we are expecting to complete the changeover action in the end of Apr 2016. This will improve our product's quality performance and tractability. We thank you for choosing Molex products. Download
01/01/2016 GCM 10692749 - Supplier Change. The purpose if this letter is to inform you that Molex CD resin supplier will change production site from Malaysia &Taiwan to Nantong, China due to supplier strategic consolidate. Download
12/15/2015 GCM 10715564 - Supplier Changes To Raw Material. This notification is to advise you of a change in supplier for the Nickel Silver base material used to make some components in some of Molex's products. The biggest users are cage components. Only the supplier will be changing, the type of the material will stay the same so there will be no impact to the form, fit, or function of the part. This change is needed because the current supplier is no longer offering the base material being used today. This will be a running change and will not affect the connector portion of the finished part. Download