501568-0207
1.00mm Pitch Pico-Clasp Wire-to-Board Header, Surface Mount, Single Row, Right Angle, Tin Plated, with Inner Friction Lock, 2 Circuits
Enhance your PCB connectivity with our Pico-Clasp connector, designed for streamlined performance. Featuring a right-angle orientation and surface mount termination, it offers seamless integration onto your board. With two contacts and a 1mm pitch, it ensures efficient data transmission at up to 1A and 50V AC/DC. Constructed with durable materials like nylon and phosphor bronze, it guarantees reliability even in harsh environments with an operating temperature range of -40 to 105°C. Its embossed tape packaging and reel format make it easy to handle during assembly. With key features like PCB retention and polarization, it provides secure and error-proof mating. RoHS compliant and UL certified, it meets global quality standards, making it the ideal choice for your electronic projects. Elevate your connectivity solutions with this essential component.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 501568-0207 |
| Color: | Natural |
| Series: | 501568 - Pico-Clasp |
| Amperage: | 1 A |
| Connector Type: | Pico-Clasp |
| Number of Contacts: | 2 |
| Number of Rows: | 1 |
| Termination Method: | Surface Mount |
| Contact Material: | Phosphor Bronze |
| Body Orientation: | Right Angle |
| Pitch: | 1 mm |
| Voltage: | 50 V AC/DC |
| Material: | Nylon |
| Orientation: | Right Angle |
| Packaging: | Embossed Tape on Reel |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Tin |
| Number of Contacts Loaded: | 2 |
| Mating Cycles: | 30 |
| PCB Locator: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | No |
| Polarized to Mate: | Yes |
| Connector System: | Wire to Board |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Glow Wire Capable: | No |
| Lock to Mating Part: | Yes |
| Stackable: | No |
| Breakaway: | No |
| Part Aliases: | 5015680207 |
| SKU: | MOL501568-0207 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 05/31/2022 | 511287 - Equipment Transfer, Production Transfer or Rearrangement. To better serve our customers and to leverage our global manufacturing footprint molex will relocate production of the wafer Assembly lines from japan to molex Vietnam production facility the transfer will start in Q1 2022 and target to complete in 2022 buffer stock and capacity tooling will be built as need to ensure a seamless transfer. |
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