501568-0407
1.00mm Pitch Pico-Clasp Wire-to-Board Header, Surface Mount, Single Row, Right Angle, Tin Plated, with Inner Friction Lock, 4 Circuits
Enhance connectivity with our Pico-Clasp 501568 series, featuring a natural color design and a surface mount termination method. These right-angle connectors, with 4 contacts in a single row, are crafted for precision and reliability. Made with durable materials like phosphor bronze and nylon, they ensure optimal performance in a wide operating temperature range. With a voltage rating of 50 V AC/DC and a current capacity of 1 A, they are suitable for various applications. RoHS compliant and UL agency certified, these connectors guarantee safety and quality. Perfect for wire-to-board setups, they offer secure mating with locking features and PCB retention. Whether for industrial or commercial use, these connectors are essential for seamless connectivity in electronic systems.
Product Category: | |
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Manufacturer: | Molex |
Manufacturer Part Number: | 501568-0407 |
Color: | Natural |
Series: | 501568 - Pico-Clasp |
Amperage: | 1 A |
Connector Type: | Pico-Clasp |
Number of Contacts: | 4 |
Number of Rows: | 1 |
Termination Method: | Surface Mount |
Contact Material: | Phosphor Bronze |
Body Orientation: | Right Angle |
Pitch: | 1 mm |
Voltage: | 50 V AC/DC |
Material: | Nylon |
Orientation: | Right Angle |
Operating Temperature Range: | -40 - 105 °C |
Contact Mating Area Plating: | Tin |
Number of Contacts Loaded: | 4 |
Mating Cycles: | 30 |
PCB Locator: | No |
PCB Retention: | Yes |
Polarized to PCB: | No |
Polarized to Mate: | Yes |
Connector System: | Wire to Board |
Contact Termination Plating: | Tin |
Glow Wire Capable: | No |
Lock to Mating Part: | Yes |
Stackable: | No |
Breakaway: | No |
Part Aliases: | 5015680407 |
SKU: | MOL501568-0407 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
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05/31/2022 | 511287 - Equipment Transfer, Production Transfer or Rearrangement. To better serve our customers and to leverage our global manufacturing footprint molex will relocate production of the wafer Assembly lines from japan to molex Vietnam production facility the transfer will start in Q1 2022 and target to complete in 2022 buffer stock and capacity tooling will be built as need to ensure a seamless transfer. |
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