501568-0407

1.00mm Pitch Pico-Clasp Wire-to-Board Header, Surface Mount, Single Row, Right Angle, Tin Plated, with Inner Friction Lock, 4 Circuits

Enhance connectivity with our Pico-Clasp 501568 series, featuring a natural color design and a surface mount termination method. These right-angle connectors, with 4 contacts in a single row, are crafted for precision and reliability. Made with durable materials like phosphor bronze and nylon, they ensure optimal performance in a wide operating temperature range. With a voltage rating of 50 V AC/DC and a current capacity of 1 A, they are suitable for various applications. RoHS compliant and UL agency certified, these connectors guarantee safety and quality. Perfect for wire-to-board setups, they offer secure mating with locking features and PCB retention. Whether for industrial or commercial use, these connectors are essential for seamless connectivity in electronic systems.
Availability
Immediate Shipment: NA
Stock Location: In Stock
Factory Stock: Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple: NA/NA
Pricing
CALL: 800.400.7041
Product Category:
Manufacturer: Molex
Manufacturer Part Number: 501568-0407
Color: Natural
Series: 501568 - Pico-Clasp
Amperage: 1 A
Connector Type: Pico-Clasp
Number of Contacts: 4
Number of Rows: 1
Termination Method: Surface Mount
Contact Material: Phosphor Bronze
Body Orientation: Right Angle
Pitch: 1 mm
Voltage: 50 V AC/DC
Material: Nylon
Orientation: Right Angle
Operating Temperature Range: -40 - 105 °C
Contact Mating Area Plating: Tin
Number of Contacts Loaded: 4
Mating Cycles: 30
PCB Locator: No
PCB Retention: Yes
Polarized to PCB: No
Polarized to Mate: Yes
Connector System: Wire to Board
Contact Termination Plating: Tin
Glow Wire Capable: No
Lock to Mating Part: Yes
Stackable: No
Breakaway: No
Part Aliases: 5015680407
SKU: MOL501568-0407

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes:

Product Change Notice

Effective Date Description of Change Download
05/31/2022 511287 - Equipment Transfer, Production Transfer or Rearrangement. To better serve our customers and to leverage our global manufacturing footprint molex will relocate production of the wafer Assembly lines from japan to molex Vietnam production facility the transfer will start in Q1 2022 and target to complete in 2022 buffer stock and capacity tooling will be built as need to ensure a seamless transfer.
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