50394-8051
Milli-Grid Crimp Terminal, Female, 0.38
Part Aliases: Molex 0503948051
Enhance your connectivity solutions with our Milli-Grid Crimp Terminal, offering reliable female termination for various applications. Designed for the 0.38 series, this terminal ensures secure contact with a current rating ranging from .5 A to 2 A and a voltage capacity of 125 V. Crafted from durable copper alloy with nickel plating, it guarantees both conductivity and longevity. Suitable for wire sizes 24 AWG to 30 AWG, it accommodates diverse setups with ease. Whether for wire-to-wire or wire-to-board connections, its gold-plated contact mating area and RoHS compliance underscore its quality and environmental responsibility. Trust in the efficiency of our Milli-Grid Crimp Terminal for seamless signal transmission in your projects.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 50394-8051 |
| Series: | 50394 - Milli-Grid |
| Amperage: | 1.5 A, 1 A, 2 A, .5 A |
| Connector Type: | Milli-Grid |
| Gender: | Female |
| Termination Method: | Crimp or Compression |
| Contact Material: | Copper Alloy |
| Contact Plating: | Nickel |
| Voltage: | 125 V |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .381 µm |
| Contact Termination Plating Thickness: | 2.032 µm |
| Wire Size: | 24 AWG, 26 AWG, 28 AWG, 30 AWG |
| Connector System: | Wire to Board, Wire to Wire |
| Contact Termination Plating: | Nickel |
| Wire Insulation Diameter: | 1.4 mm |
| Part Aliases: | 0503948051 |
| SKU: | MOL50394-8051 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 10/20/2020 | 508388 - Manufacturing Process Change. change process from Stamping (Blanking = Forming) -> plating to stamping (blanking)-> plating-> stamping (forming) for gold spotting process capability. the plating process change from dipping + brushing -> selective dipping + spotting. | Download |