501568-0507
1.00mm Pitch Pico-Clasp Wire-to-Board Header, Surface Mount, Single Row, Right Angle, Tin Plated, with Inner Friction Lock, 5 Circuits
Introducing the Pico-Clasp 501568 series, a reliable solution for your PCB connector needs. With a right-angle orientation and surface mount termination method, this connector offers seamless integration into your designs. Its five contacts, made of phosphor bronze and plated with tin, ensure efficient power transfer at 1 A and 50 V AC/DC. Operating in a wide temperature range from -40 to 105 °C, it guarantees performance in diverse environments. Featuring embossed tape packaging on a reel, it's convenient for automated assembly. With UL certification and RoHS compliance, you can trust in its quality and environmental responsibility. Ideal for wire-to-board connections, this connector is a vital component for your electronic projects.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 501568-0507 |
| Color: | Natural |
| Series: | 501568 - Pico-Clasp |
| Amperage: | 1 A |
| Connector Type: | Pico-Clasp |
| Number of Contacts: | 5 |
| Number of Rows: | 1 |
| Termination Method: | Surface Mount |
| Contact Material: | Phosphor Bronze |
| Body Orientation: | Right Angle |
| Pitch: | 1 mm |
| Voltage: | 50 V AC/DC |
| Material: | Nylon |
| Orientation: | Right Angle |
| Packaging: | Embossed Tape on Reel |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Tin |
| Number of Contacts Loaded: | 5 |
| Mating Cycles: | 30 |
| PCB Locator: | No |
| PCB Retention: | Yes |
| Polarized to PCB: | No |
| Polarized to Mate: | Yes |
| Connector System: | Wire to Board |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Glow Wire Capable: | No |
| Lock to Mating Part: | Yes |
| Stackable: | No |
| Breakaway: | No |
| Part Aliases: | 5015680507 |
| SKU: | MOL501568-0507 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 05/31/2022 | 511287 - Equipment Transfer, Production Transfer or Rearrangement. To better serve our customers and to leverage our global manufacturing footprint molex will relocate production of the wafer Assembly lines from japan to molex Vietnam production facility the transfer will start in Q1 2022 and target to complete in 2022 buffer stock and capacity tooling will be built as need to ensure a seamless transfer. |
Download |