87427-0602
Mini-Fit Jr. Header, 4.20mm Pitch, Right-Angle, without Flange, 6 Circuits, Tin (Sn) over Nickel (Ni) Plating
Part Aliases: Molex 0874270602
Enhance your PCB connections with our Mini-Fit Jr. Header, featuring a 4.20mm pitch and right-angle orientation for seamless integration. This connector, with 6 circuits, ensures reliable power and signal transmission in your electronic assemblies. Constructed with high-quality materials, including brass contacts and a nylon body, it offers durability for long-term use. The tin plating over nickel enhances conductivity while meeting RoHS compliance standards. With a 13A current rating and 600V voltage rating, it's suitable for a wide range of applications. The through-hole termination method and 3.3mm tail length simplify installation, making it ideal for both prototyping and production. Its polarized design and secure locking feature provide added stability, while the operating temperature range of -40 to 105°C ensures performance in various environments. Trust in our Mini-Fit Jr. Header for efficient and dependable connectivity in your designs.
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 87427-0602 |
Color: | Beige |
Series: | 87427 - Mini-Fit Jr. |
Amperage: | 13 A |
Connector Type: | Mini-Fit Jr. |
Number of Contacts: | 6 |
Number of Rows: | 2 |
Termination Method: | Through Hole |
Contact Material: | Brass |
Body Orientation: | Right Angle |
Pitch: | 4.2 mm |
Voltage: | 600 V |
Material: | Nylon |
Orientation: | Right Angle |
Tail Length: | 3.3 mm |
Operating Temperature Range: | -40 - 105 °C |
Contact Mating Area Plating: | Tin |
Contact Mating Area Plating Thickness: | 2.54 µm |
Number of Contacts Loaded: | 6 |
Mating Cycles: | 30 |
PCB Locator: | No |
PCB Retention: | Without |
Polarized to PCB: | No |
Contact Termination Plating Thickness: | 2.540 µm |
Polarized to Mate: | Yes |
PCB Thickness (Recommended): | 1.6 mm |
Connector System: | Wire to Board |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 260 °C |
Lead Free Process Capability: | WAVE |
Duration at Max. Process Temperature (seconds): | 005 |
Max. Cycles at Max. Process Temperature: | 001 |
Termination Pitch: | 4.2 mm |
Glow Wire Capable: | No |
Lock to Mating Part: | Yes |
Stackable: | No |
Surface Mount Compatible: | No |
Breakaway: | No |
Make First / Break Last: | No |
Shroud Type: | Fully |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 0874270602 |
SKU: | MOL87427-0602 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
12/31/2022 | 512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change | Download |
03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download |
10/30/2020 | 509404 - Packaging Method/Quantity Changing. Aligning system DU/MLQ to PKG Drawing, we observed that the packaging DU & MLQs are different between the packaging specification drawing and the system value. | Download |
05/15/2020 | 508489 - Supplier change. Reel plating process of identified products will be carried out at vendor location. | Download |
11/24/2018 | 505685 - Manufacturing Process Change. This letter is to inform you that the manufacturing process for the part(s) identified in this notice is changing. No changes will be made to the product as a result of this process change. | Download |
09/05/2015 | GCM 10699821 - New, Modified, Or Replacement Tooling. | Download |
07/10/2015 | GCM 10692859 - Manufacturing Process Change. | Download |