71764-0020
2.54mm Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 20 Circuits, Tin (Sn) Plating
Elevate your connectivity with our C-Grid 20-pin right-angle header, designed for optimized performance on PCBs. Featuring a durable construction with high-temperature thermoplastic and brass/phosphor bronze contacts, it ensures reliable power delivery at an amperage of 3A and voltage of 250V. With a pitch of 2.54mm and through-hole termination, it offers secure attachment for seamless integration. RoHS compliant and UL certified, this connector guarantees quality and safety in every application, whether for board-to-board or wire-to-board connections. Its stackable and breakaway features provide versatility in usage, making it a versatile choice for various electronic projects. Trusted for its 25 mating cycles and operating temperature range of -40 to 105°C, it's the perfect solution for demanding environments. Upgrade your connectivity with this essential component, where precision meets performance.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 71764-0020 |
| Color: | Black |
| Series: | 71764 - C-Grid |
| Amperage: | 3 A |
| Connector Type: | C-Grid |
| Number of Contacts: | 20 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole |
| Contact Material: | Brass, Phosphor Bronze |
| Body Orientation: | Right Angle |
| Pitch: | 2.54 mm |
| Voltage: | 250 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Right Angle |
| Tail Length: | 2.79 mm |
| Packaging: | Tube |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Tin |
| Contact Mating Area Plating Thickness: | 3.81 µm |
| Number of Contacts Loaded: | 20 |
| Mating Cycles: | 25 |
| PCB Locator: | No |
| PCB Retention: | Without |
| Contact Termination Plating Thickness: | 3.81 µm |
| Polarized to Mate: | No |
| Connector System: | Board to Board, Wire to Board |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | SMC and Wave |
| Glow Wire Capable: | No |
| Lock to Mating Part: | No |
| Stackable: | Yes |
| Breakaway: | Yes |
| Shroud Type: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0717640020 |
| SKU: | MOL71764-0020 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/30/2022 | 511846 - Capacity change or tool replacement Equipment Transfer, Production Transfer or Rearrangement. This notification is to inform about new die tooling fabricate in Malaysia is being added to meet the current and future demands of this product referenced below. This notification also add additional manufacturing location for Unity pin Series. The reason for the change is to secure the supply of Bandolier pin for Molex Malaysia. | Download |