71764-0104
2.54mm Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 4 Circuits, 0.38
Easily connect your electronic components with this high-quality C-Grid PCB Pin Header, featuring a right-angle orientation for convenient installation. Boasting a durable construction with brass and phosphor bronze contacts, it offers reliable performance in a variety of applications. With a pitch of 2.54mm and 4 contacts spread across 2 rows, it provides efficient connectivity. Certified for use in both Board to Board and Wire to Board setups, it is UL and CSA agency approved for safety and quality assurance. RoHS compliant and lead-free process capable, this connector is environmentally friendly. Its gold-plated contact mating area ensures optimal conductivity, while its high-temperature thermoplastic body can withstand operating temperatures ranging from -40 to 105°C. Suitable for through-hole termination, this C-Grid connector is stackable and breakaway, offering versatility in design and installation. Upgrade your PCB connections with this essential component.
Product Category: | |
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Manufacturer: | Molex |
Manufacturer Part Number: | 71764-0104 |
Color: | Black |
Series: | 71764 - C-Grid |
Amperage: | 3 A |
Connector Type: | C-Grid |
Number of Contacts: | 4 |
Number of Rows: | 2 |
Termination Method: | Through Hole |
Contact Material: | Brass, Phosphor Bronze |
Body Orientation: | Right Angle |
Pitch: | 2.54 mm |
Voltage: | 250 V |
Material: | High Temperature Thermoplastic |
Orientation: | Right Angle |
Tail Length: | 2.79 mm |
Packaging: | Tube |
Operating Temperature Range: | -40 - 105 °C |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .381 µm |
Number of Contacts Loaded: | 4 |
Mating Cycles: | 50 |
PCB Locator: | No |
PCB Retention: | Without |
Contact Termination Plating Thickness: | 1.905 µm |
Polarized to Mate: | No |
Connector System: | Board to Board, Wire to Board |
CSA Agency Certification: | LR19980 |
UL Agency Certification: | E29179 |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 245 °C |
Lead Free Process Capability: | WAVE |
Duration at Max. Process Temperature (seconds): | 005 |
Max. Cycles at Max. Process Temperature: | 001 |
Glow Wire Capable: | No |
Lock to Mating Part: | No |
Stackable: | Yes |
Breakaway: | Yes |
Shroud Type: | No |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 0717640104 |
SKU: | MOL71764-0104 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
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12/30/2022 | 511846 - Capacity change or tool replacement Equipment Transfer, Production Transfer or Rearrangement. This notification is to inform about new die tooling fabricate in Malaysia is being added to meet the current and future demands of this product referenced below. This notification also add additional manufacturing location for Unity pin Series. The reason for the change is to secure the supply of Bandolier pin for Molex Malaysia. | Download |