71764-0130
2.54mm Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 30 Circuits, 0.38
Elevate your connectivity with our C-Grid 71764 series Right Angle PCB Pin Header. Featuring a sleek black design, this high-performance component boasts 30 gold-plated contacts for reliable power and data transmission. With a 2.54mm pitch and a 3A amperage rating, it's ideal for various board-to-board and wire-to-board applications. Crafted from durable high-temperature thermoplastic, it ensures longevity even in harsh operating conditions. RoHS compliant and UL certified, this connector guarantees both quality and safety. Upgrade your electronic projects with this versatile and dependable component.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 71764-0130 |
| Color: | Black |
| Series: | 71764 - C-Grid |
| Amperage: | 3 A |
| Connector Type: | C-Grid |
| Number of Contacts: | 30 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole |
| Contact Material: | Brass, Phosphor Bronze |
| Body Orientation: | Right Angle |
| Pitch: | 2.54 mm |
| Voltage: | 250 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Right Angle |
| Tail Length: | 2.79 mm |
| Packaging: | Tube |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .381 µm |
| Number of Contacts Loaded: | 30 |
| Mating Cycles: | 50 |
| PCB Locator: | No |
| PCB Retention: | Without |
| Contact Termination Plating Thickness: | 1.905 µm |
| Polarized to Mate: | No |
| Connector System: | Board to Board, Wire to Board |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Glow Wire Capable: | No |
| Lock to Mating Part: | No |
| Stackable: | Yes |
| Breakaway: | Yes |
| Shroud Type: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0717640130 |
| SKU: | MOL71764-0130 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/30/2022 | 511846 - Capacity change or tool replacement Equipment Transfer, Production Transfer or Rearrangement. This notification is to inform about new die tooling fabricate in Malaysia is being added to meet the current and future demands of this product referenced below. This notification also add additional manufacturing location for Unity pin Series. The reason for the change is to secure the supply of Bandolier pin for Molex Malaysia. | Download |
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download |
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. |
Download |
| 03/31/2020 | 507616 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different production location. No changes will be made to the product as a result of this move. | Download |