71764-0126
2.54mm Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 26 Circuits, 0.38
Introducing the C-Grid 71764 series, this black right angle connector is a reliable choice for your electronic connections. With 26 contacts in a 2-row configuration, it offers secure through-hole termination on your PCB. Featuring a pitch of 2.54 mm and a 3 A amperage rating, it is suitable for various applications. Constructed with high temperature thermoplastic and gold-plated brass contacts, it ensures both durability and excellent conductivity. With a voltage rating of 250 V and an operating temperature range of -40 to 105 °C, it meets stringent performance standards. RoHS compliant and UL certified, it is a quality component for your assembly needs. The stackable and breakaway design adds versatility, while the option for lead-free soldering makes it environmentally friendly. As part of the C-Grid connector system, it can be used for board-to-board or wire-to-board connections with ease. Perfect for use in industrial, automotive, or consumer electronics, this connector is a dependable choice for your projects.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 71764-0126 |
| Color: | Black |
| Series: | 71764 - C-Grid |
| Amperage: | 3 A |
| Connector Type: | C-Grid |
| Number of Contacts: | 26 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole |
| Contact Material: | Brass, Phosphor Bronze |
| Body Orientation: | Right Angle |
| Pitch: | 2.54 mm |
| Voltage: | 250 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Right Angle |
| Tail Length: | 2.79 mm |
| Packaging: | Tube |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .381 µm |
| Number of Contacts Loaded: | 26 |
| Mating Cycles: | 50 |
| PCB Locator: | No |
| PCB Retention: | Without |
| Contact Termination Plating Thickness: | 1.905 µm |
| Polarized to Mate: | No |
| Connector System: | Board to Board, Wire to Board |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | SMC and Wave |
| Glow Wire Capable: | No |
| Lock to Mating Part: | No |
| Stackable: | Yes |
| Breakaway: | Yes |
| Shroud Type: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0717640126 |
| SKU: | MOL71764-0126 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/30/2022 | 511846 - Capacity change or tool replacement Equipment Transfer, Production Transfer or Rearrangement. This notification is to inform about new die tooling fabricate in Malaysia is being added to meet the current and future demands of this product referenced below. This notification also add additional manufacturing location for Unity pin Series. The reason for the change is to secure the supply of Bandolier pin for Molex Malaysia. | Download |