15-91-6040
2.54mm Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs, Tape and Reel
Discover the versatility of our 71308 - C-Grid series with this straight, black PCB pin header. Designed for surface mount applications, it features four contacts in a two-row configuration, perfect for board-to-board or wire-to-board connections. With a pitch of 2.54mm and a current rating of 3A, this connector ensures reliable performance in various electronic devices. Made from high-temperature thermoplastic and compliant with RoHS standards, it guarantees durability and environmental safety. Embossed tape packaging with pick and place capability streamlines assembly processes, while its operating temperature range of -40 to 105°C accommodates different usage environments. Each contact is plated with tin for optimal conductivity, with a thickness of 3.81µm. Stackable, breakaway, and UL-certified, this C-Grid connector offers a complete solution for your PCB connectivity needs.
Product Category: | |
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Manufacturer: | Molex |
Manufacturer Part Number: | 15-91-6040 |
Color: | Black |
Series: | 71308 - C-Grid |
Amperage: | 3 A |
Connector Type: | C-Grid |
Number of Contacts: | 4 |
Number of Rows: | 2 |
Termination Method: | Surface Mount |
Contact Material: | Phosphor Bronze |
Body Orientation: | Straight |
Pitch: | 2.54 mm |
Voltage: | 250 V |
Material: | High Temperature Thermoplastic |
Orientation: | Vertical |
Packaging: | Embossed Tape on Reel |
Pick and Place: | With Pick and Place Cap |
Operating Temperature Range: | -40 - 105 °C |
Contact Mating Area Plating: | Tin |
Contact Mating Area Plating Thickness: | 3.81 µm |
Number of Contacts Loaded: | 4 |
Mating Cycles: | 25 |
PCB Locator: | No |
PCB Retention: | Without |
Polarized to PCB: | No |
Contact Termination Plating Thickness: | 3.81 µm |
Polarized to Mate: | No |
Connector System: | Board to Board, Wire to Board |
CSA Agency Certification: | LR19980 |
UL Agency Certification: | E29179 |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 245 °C |
Lead Free Process Capability: | REFLOW |
Duration at Max. Process Temperature (seconds): | 030 |
Max. Cycles at Max. Process Temperature: | 003 |
Glow Wire Capable: | No |
Lock to Mating Part: | No |
Stackable: | Yes |
Breakaway: | Yes |
Shroud Type: | No |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 0015916040;71308-1504 |
SKU: | MOL15-91-6040 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
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03/31/2022 | 510906 - Packaging change/qty change. This notification is to inform you about part(s) listed in this notice that will undergo changes for standardize packaging standard on 71308 C grid product series as below: a) DU Quantity. b) Emboss tape flanges size diameter. c) Emboss tape color. d) Emboss tape hole. |
Download |