50394-8100
Milli-Grid Crimp Terminal, Female, 0.38
Part Aliases: Molex 0503948100
Easily connect wires with our Milli-Grid Crimp Terminal for seamless signal transmission. This female terminal, part of the 0.38 series, features a durable copper alloy construction with nickel plating for enhanced conductivity and longevity. Suitable for wire sizes ranging from 24 to 30 AWG, it offers versatile compatibility for various applications. The gold plating in the contact mating area ensures reliable connections, while the nickel termination plating provides added durability. RoHS compliant and packaged in a convenient bag, this terminal is an essential component for wire-to-wire or wire-to-board connections in your projects. Trust in its quality and performance for seamless electronic connections.
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 50394-8100 |
Series: | 50394 - Milli-Grid |
Connector Type: | Milli-Grid |
Gender: | Female |
Termination Method: | Crimp or Compression |
Contact Material: | Copper Alloy |
Contact Plating: | Nickel |
Packaging: | Bag |
Circuit Application: | Signal |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .381 µm |
Contact Termination Plating Thickness: | 2.032 µm |
Wire Size: | 24 AWG, 26 AWG, 28 AWG, 30 AWG |
Connector System: | Wire to Board, Wire to Wire |
Contact Termination Plating: | Nickel |
Wire Insulation Diameter: | 1.4 mm |
Part Aliases: | 0503948100 |
SKU: | MOL50394-8100 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
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10/20/2020 | 508388 - Manufacturing Process Change. change process from Stamping (Blanking = Forming) -> plating to stamping (blanking)-> plating-> stamping (forming) for gold spotting process capability. the plating process change from dipping + brushing -> selective dipping + spotting. | Download |