171395-1107
Impel 92 Ohm, 6 Pair Vertical Backplane Header, 1.90mm Pitch, Unguided, Open Endwalls, 10 Columns, 120 Circuits, Pin Length 4.90mm, Plated Through Hole Dimension 0.36mm
Enhance your PCB connectivity with the Impel 92 Ohm Vertical Backplane Header. Featuring 6 pairs of high-performance contacts in a 1.90mm pitch, this header offers optimal signal transmission for data rates up to 40 Gb/s. With 10 columns and 120 circuits, it provides ample connectivity options for your applications. The gold-plated contacts ensure reliable performance, while the full shield design protects against electromagnetic interference. Constructed with high-temperature thermoplastic, this header is suitable for a wide range of operating environments. Trusted for its quality and compliance with RoHS standards, it is the perfect solution for your backplane connector needs.
| Product Category: | |
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| Manufacturer: | Molex |
| Manufacturer Part Number: | 171395-1107 |
| Color: | Black |
| Series: | 171395 - Impel |
| Amperage: | .75 A |
| Connector Type: | Impel |
| Number of Contacts: | 120 |
| Number of Rows: | 12 |
| Contact Material: | High Performance Alloy (HPA) |
| Contact Plating: | Gold |
| Maximum Operating Temperature: | 85 °C |
| Minimum Operating Temperature: | -55 °C |
| Pitch: | 1.9 mm |
| Voltage: | 150 V AC/DC |
| Shield Type: | Full Shield |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Impedance: | 92 Ω |
| Keying: | No |
| Component Type: | PCB Header |
| Number of Pairs: | 6-pair |
| Data Rate: | 40 Gb/s |
| Tail Length: | 1.3 mm |
| Packaging: | Tray |
| Operating Temperature Range: | -55 - 85 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 120 |
| Mating Cycles: | 200 |
| PCB Locator: | No |
| PCB Retention: | Without |
| PCB Thickness (Recommended): | 1 mm |
| Number of Columns: | 10 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Nickel, Tin |
| Termination Pitch: | 1.9 mm |
| Guide to Mating Part: | No |
| Board to Board Configuration: | Backplane |
| Make First / Break Last: | No |
| Part Aliases: | 1713951107 |
| SKU: | MOL171395-1107 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 09/11/2022 | 512356 - Capacity change or tool replacement. This notification is to inform you about set of tooling is being added to meet the current and future demands of this product referenced below. There will be no changes in fit, form or function from additional tooling when compared to the existing tooling | Download |
| 05/08/2019 | 507161 - Supplier change. Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. | Download |
| 11/30/2015 | GCM 10727338 - New, Modified, Or Replacement Tooling. Molex is adding capacity to the Impel line for both Headers and DC modules. Product produced after Nov 2015 might contain parts produced from the added capacity. Molex had qualified the product produced from the added capacity prior shipment. | Download |
| 06/30/2014 | GCM 10631242 - Product Component Change. This GCN covers changing the pin design for Impel backplane pin 171308, assembled to series 171395 and 171755 to improve true position of the final assemblies as well as further optmizing the Impel backplane connector impedance which is not visible to customer and does not affect the mating interface. Pins have a smaller gap in the floor transition and the centerline of pin retention area was move from the pin centerline to the tail centerline. |
Download |