171395-1607
Impel 92 Ohm, 6 Pair Vertical Backplane Header, 1.90mm Pitch, Unguided, Open Endwalls, 16 Columns, 192 Circuits, Pin Length 4.90mm, Plated Through Hole Dimension 0.36mm
Elevate your backplane connections with our Impel 92 Ohm, 6 Pair Vertical Header. Featuring 192 gold-plated circuits in 16 columns, this high-performance connector ensures reliable signal transmission at speeds up to 40 Gb/s. Crafted with precision from durable Thermoplastic, it guarantees longevity in demanding environments. With a pitch of 1.9mm and an impedance of 92Ω, it's ideal for high-speed data applications. The unguded design and open endwalls offer flexibility in installation, while the full shield provides enhanced EMI protection. RoHS compliant and UL certified, this connector is a trusted choice for your PCB needs. Operating temperature range from -55 to 85°C, this connector guarantees reliable performance in a wide range of conditions. Elevate your backplane connections with our Impel 92 Ohm, 6 Pair Vertical Header. Featuring 192 gold-plated circuits in 16 columns, this high-performance connector ensures reliable signal transmission at speeds up to 40 Gb/s. Crafted with precision from durable Thermoplastic, it guarantees longevity in demanding environments. With a pitch of 1.9mm and an impedance of 92Ω, it's ideal for high-speed data applications. The unguded design and open endwalls offer flexibility in installation, while the full shield provides enhanced EMI protection. RoHS compliant and UL certified, this connector is a trusted choice for your PCB needs. Operating temperature range from -55 to 85°C, this connector guarantees reliable performance in a wide range of conditions.
Product Category: | |
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Manufacturer: | Molex |
Manufacturer Part Number: | 171395-1607 |
Color: | Black |
Series: | 171395 - Impel |
Amperage: | .75 A |
Connector Type: | Impel |
Number of Contacts: | 192 |
Number of Rows: | 12 |
Contact Material: | High Performance Alloy (HPA) |
Contact Plating: | Gold |
Maximum Operating Temperature: | 85 °C |
Minimum Operating Temperature: | -55 °C |
Pitch: | 1.9 mm |
Voltage: | 150 V AC/DC |
Shield Type: | Full Shield |
Material: | High Temperature Thermoplastic |
Orientation: | Vertical |
Impedance: | 92 Ω |
Keying: | No |
Component Type: | PCB Header |
Number of Pairs: | 6-pair |
Data Rate: | 40 Gb/s |
Tail Length: | 1.3 mm |
Packaging: | Tray |
Operating Temperature Range: | -55 - 85 °C |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .762 µm |
Number of Contacts Loaded: | 192 |
Mating Cycles: | 200 |
PCB Locator: | No |
PCB Retention: | Without |
PCB Thickness (Recommended): | 1 mm |
Number of Columns: | 16 |
UL Agency Certification: | E29179 |
Contact Termination Plating: | Nickel, Tin |
Termination Pitch: | 1.9 mm |
Guide to Mating Part: | No |
Board to Board Configuration: | Backplane |
Make First / Break Last: | No |
Part Aliases: | 1713951607 |
SKU: | MOL171395-1607 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
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09/11/2022 | 512356 - Capacity change or tool replacement. This notification is to inform you about set of tooling is being added to meet the current and future demands of this product referenced below. There will be no changes in fit, form or function from additional tooling when compared to the existing tooling | Download |
05/08/2019 | 507161 - Supplier change. Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. | Download |
06/30/2014 | GCM 10631242 - Product Component Change. This GCN covers changing the pin design for Impel backplane pin 171308, assembled to series 171395 and 171755 to improve true position of the final assemblies as well as further optmizing the Impel backplane connector impedance which is not visible to customer and does not affect the mating interface. Pins have a smaller gap in the floor transition and the centerline of pin retention area was move from the pin centerline to the tail centerline. |
Download |