171395-1607

Impel 92 Ohm, 6 Pair Vertical Backplane Header, 1.90mm Pitch, Unguided, Open Endwalls, 16 Columns, 192 Circuits, Pin Length 4.90mm, Plated Through Hole Dimension 0.36mm

Elevate your backplane connections with our Impel 92 Ohm, 6 Pair Vertical Header. Featuring 192 gold-plated circuits in 16 columns, this high-performance connector ensures reliable signal transmission at speeds up to 40 Gb/s. Crafted with precision from durable Thermoplastic, it guarantees longevity in demanding environments. With a pitch of 1.9mm and an impedance of 92Ω, it's ideal for high-speed data applications. The unguded design and open endwalls offer flexibility in installation, while the full shield provides enhanced EMI protection. RoHS compliant and UL certified, this connector is a trusted choice for your PCB needs. Operating temperature range from -55 to 85°C, this connector guarantees reliable performance in a wide range of conditions. Elevate your backplane connections with our Impel 92 Ohm, 6 Pair Vertical Header. Featuring 192 gold-plated circuits in 16 columns, this high-performance connector ensures reliable signal transmission at speeds up to 40 Gb/s. Crafted with precision from durable Thermoplastic, it guarantees longevity in demanding environments. With a pitch of 1.9mm and an impedance of 92Ω, it's ideal for high-speed data applications. The unguded design and open endwalls offer flexibility in installation, while the full shield provides enhanced EMI protection. RoHS compliant and UL certified, this connector is a trusted choice for your PCB needs. Operating temperature range from -55 to 85°C, this connector guarantees reliable performance in a wide range of conditions.
Availability
Immediate Shipment: NA
Stock Location: In Stock
Factory Stock: Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple: NA/NA
Pricing
CALL: 800.400.7041
Product Category:
Manufacturer: Molex
Manufacturer Part Number: 171395-1607
Color: Black
Series: 171395 - Impel
Amperage: .75 A
Connector Type: Impel
Number of Contacts: 192
Number of Rows: 12
Contact Material: High Performance Alloy (HPA)
Contact Plating: Gold
Maximum Operating Temperature: 85 °C
Minimum Operating Temperature: -55 °C
Pitch: 1.9 mm
Voltage: 150 V AC/DC
Shield Type: Full Shield
Material: High Temperature Thermoplastic
Orientation: Vertical
Impedance: 92 Ω
Keying: No
Component Type: PCB Header
Number of Pairs: 6-pair
Data Rate: 40 Gb/s
Tail Length: 1.3 mm
Packaging: Tray
Operating Temperature Range: -55 - 85 °C
Contact Mating Area Plating: Gold
Contact Mating Area Plating Thickness: .762 µm
Number of Contacts Loaded: 192
Mating Cycles: 200
PCB Locator: No
PCB Retention: Without
PCB Thickness (Recommended): 1 mm
Number of Columns: 16
UL Agency Certification: E29179
Contact Termination Plating: Nickel, Tin
Termination Pitch: 1.9 mm
Guide to Mating Part: No
Board to Board Configuration: Backplane
Make First / Break Last: No
Part Aliases: 1713951607
SKU: MOL171395-1607

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes:

Product Change Notice

Effective Date Description of Change Download
09/11/2022 512356 - Capacity change or tool replacement. This notification is to inform you about set of tooling is being added to meet the current and future demands of this product referenced below. There will be no changes in fit, form or function from additional tooling when compared to the existing tooling Download
05/08/2019 507161 - Supplier change. Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. Download
06/30/2014 GCM 10631242 - Product Component Change. This GCN covers changing the pin design for Impel backplane pin 171308, assembled to series 171395 and 171755 to improve true position of the final assemblies as well as further optmizing the Impel backplane connector impedance which is not visible to
customer and does not affect the mating interface. Pins have a smaller gap in the floor transition and the centerline of pin retention area was move from the pin centerline to the tail centerline.
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