171395-5617
Impel 92 Ohm, 6 Pair Vertical Backplane Header, 1.90mm Pitch, Right Guided, Open Endwalls, 16 Columns, 192 Circuits, Pin Length 4.90mm, Plated Through Hole Dimension 0.36mm, Keying Orientation A
Introducing the Impel 92 Ohm Vertical Backplane Header, designed for high-speed connectivity in demanding applications. This 6 Pair header features a 1.90mm pitch, with Right Guided orientation and Open Endwalls for easy installation. With 16 columns and 192 circuits, it ensures reliable performance in complex PCB setups. The Pin Length of 4.90mm and Plated Through Hole Dimension of 0.36mm offer robust connectivity, while the High Performance Alloy (HPA) contact material and Gold plating in the mating area guarantee excellent signal integrity. Operating at a voltage of 150V AC/DC and an amperage of .75A, this header is suitable for a wide range of power and data transmission requirements. Its Full Shield design, along with keying orientation and high-temperature thermoplastic construction, provide durability and EMI protection. With a data rate of 40Gb/s and an impedance of 92Ω, it meets the demands of modern high-speed communication systems. RoHS compliant and UL certified, this header ensures quality and compliance in all installations. Whether for telecommunications, industrial, or aerospace applications, the Impel Vertical Backplane Header delivers performance you can rely on.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | 171395-5617 |
| Color: | Black |
| Series: | 171395 - Impel |
| Amperage: | .75 A |
| Connector Type: | Impel |
| Number of Contacts: | 192 |
| Number of Rows: | 12 |
| Contact Material: | High Performance Alloy (HPA) |
| Pitch: | 1.9 mm, 3 mm |
| Voltage: | 150 V AC/DC |
| Shield Type: | Full Shield |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Impedance: | 92 Ω |
| Keying: | Yes |
| Component Type: | PCB Header |
| Number of Pairs: | 6 |
| Data Rate: | 40 Gb/s |
| Tail Length: | 1.3 mm |
| Packaging: | Tray |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 192 |
| Mating Cycles: | 200 |
| PCB Locator: | No |
| PCB Retention: | Without |
| PCB Thickness (Recommended): | 1 mm |
| Number of Columns: | 16 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Nickel, Tin |
| Termination Pitch: | 1.9 mm, 3 mm |
| Guide to Mating Part: | Yes |
| Board to Board Configuration: | Backplane |
| Make First / Break Last: | No |
| Part Aliases: | 1713955617 |
| SKU: | MOL171395-5617 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 09/11/2022 | 512356 - Capacity change or tool replacement. This notification is to inform you about set of tooling is being added to meet the current and future demands of this product referenced below. There will be no changes in fit, form or function from additional tooling when compared to the existing tooling | Download |